Patents by Inventor Hung-Ya Chao

Hung-Ya Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6375872
    Abstract: A microencapsulated adhesive and a method for producing that microencapsulated adhesive is disclosed. The adhesive is produced from an alkyl acrylate or methacrylate monomer having about 4 to about 12 carbon atoms, or a mixture thereof. The monomer is encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The microcapsules may be polyamide or polyurea. The monomer is polymerized in the microcapsules by heating to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
    Type: Grant
    Filed: November 17, 1992
    Date of Patent: April 23, 2002
    Assignee: Moore Business Forms
    Inventor: Hung Ya Chao
  • Patent number: 5919407
    Abstract: A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition or an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
    Type: Grant
    Filed: December 28, 1992
    Date of Patent: July 6, 1999
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung Ya Chao
  • Patent number: 5709340
    Abstract: A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
    Type: Grant
    Filed: August 18, 1995
    Date of Patent: January 20, 1998
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung Ya Chao
  • Patent number: 5015527
    Abstract: An epoxy microcapsule comprising an oil core material and a microcapsule wall enclosing the oil core material. The microcapsule wall is an interfacial polymerization product of an epoxy resin and a polyamino compound having multifunctional amino groups capable of crosslinking the epoxy resin. The epoxy resin is preferably bisphenol A or bisphenol F based epoxy resin. The polyamino compound preferably has primary and tertiary amino groups. The epoxy microcapsule can be used in carbonless copying systems.
    Type: Grant
    Filed: January 13, 1989
    Date of Patent: May 14, 1991
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung-Ya Chao
  • Patent number: 4785048
    Abstract: An improved process for the production of microcapsules by the use of hydrogen transfer polymerization in the presence of a mixture of emulsifiers including either an aqueous solution of a sodium salt of naphthalene-sulfonic acid-formaldehyde condensate or diphenyloxide disulfonate with a polyvinyl alcohol. The process is particularly useful for the production of microcapsules containing a colorless dye intermediate used in carbonless copy paper (CCP) applications.
    Type: Grant
    Filed: February 8, 1988
    Date of Patent: November 15, 1988
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung-Ya Chao
  • Patent number: 4626471
    Abstract: A method of forming microcapsules by in-situ polymerization is disclosed. The microcapsules are prepared by forming an organic solution containing a polyfunctional amine curing agent and an epoxy resin select from the group consisting of 4-glycidyloxy-N, N-di-glycidyl aniline and methylolated bisphenol A based epoxy resins. This organic solution is then dispersed or emulsified within an aqueous continuous phase. The amine agent then polymerizes the epoxy resin, which migrates to the interface between the continuous and discontinuous phases to form the microcapsular wall. The resulting microcapsules are characterized by relatively high impermeability and are especially useful in carbonless copying systems.
    Type: Grant
    Filed: February 25, 1985
    Date of Patent: December 2, 1986
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung-Ya Chao
  • Patent number: 4599271
    Abstract: A method of microencapsulation is disclosed whereby two or more organic-in-aqueous emulsions, each containing a reactive component in the organic phase, are mixed together causing the reactive components to react and form polymeric walls around the organic droplets. Either, neither or both emulsions may contain one or more fill materials in their organic phases.
    Type: Grant
    Filed: September 10, 1984
    Date of Patent: July 8, 1986
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung-Ya Chao
  • Patent number: 4495509
    Abstract: A method of microencapsulation is disclosed whereby two or more organic-in-aqueous emulsions, each containing a reactive component in the organic phase, are mixed together causing the reactive components to react and form polymeric walls around the organic droplets. Either or both emulsions may contain one or more fill materials in their organic phases.
    Type: Grant
    Filed: June 9, 1983
    Date of Patent: January 22, 1985
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung-Ya Chao
  • Patent number: 4209188
    Abstract: Disclosed are improved microcapsules comprising a core of fill material, at least one generally continuous wall encapsulating the core, and the reaction product of a methylolated epoxy compound and material of the outermost wall as at least a portion of the outermost surface of the microcapsule, the reaction product, among other things, tending to close discontinuities in the encapsulating wall. When containing a colorless dye precursor and utilized in carbonless copying systems, the improved microcapsules help to reduce discoloration caused by leakage or premature rupture and release of the dye precursor while still providing good image intensity of marks produced by the system. Also disclosed are methods of making the improved microcapsules.
    Type: Grant
    Filed: April 11, 1978
    Date of Patent: June 24, 1980
    Assignee: Moore Business Forms, Inc.
    Inventors: Hung-Ya Chao, George E. Maalouf
  • Patent number: H509
    Abstract: Adhesives comprising microparticles of acrylate copolymers are formed from higher homologs of acrylates and methacrylates. By varying the type and amount of monomers used in the starting solution the tack level may be varied. Very high tack levels are achieved with compositions made from isodecyl acrylate and 2-ethylhexyl acrylate where acrylic acid, isobornyl acrylate and vinyl pyrrolidone are included in the starting mixture and where polyvinyl alcohol is used to avoid agglomeration.
    Type: Grant
    Filed: December 22, 1987
    Date of Patent: August 2, 1988
    Inventor: Hung-Ya Chao