Patents by Inventor Hung-Yao Huang

Hung-Yao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Feedback control system achieving high performance via density modulation
    Patent number: 11996866
    Abstract: A feedback control system configured to drive a load is disclosed. The feedback control system includes an up-sampling circuit, configured to perform an un-sampling operation on a source signal and produce an up-sampled signal with an up-sampling frequency according to the up-sampled signal and a feedback signal from the load; a delta circuit, coupled to the up-sampling circuit and configured to produce a delta signal; a sigma circuit, configured to produce a density modulation signal according to the delta signal; and a driving device, configured to drive the load according to the density modulation signal with the up-sampling frequency.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: May 28, 2024
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Hsi-Sheng Chen, Chieh-Yao Chang, Hung-Chi Huang, Jing-Meng Liu
  • MANUFACTURING METHOD OF INTERCONNECT STRUCTURE
    Publication number: 20230187272
    Abstract: A manufacturing method of an interconnect structure including the following is provided. A substrate is provided. Sacrificial layers are formed on the substrate. A dielectric layer is formed between two adjacent sacrificial layers. There is an air gap in the dielectric layer. The sacrificial layers are removed to form first openings. A conductive layer is formed in the first opening.
    Type: Application
    Filed: January 26, 2022
    Publication date: June 15, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Hung-Yao Huang, Shyng-Yeuan Che, Ching-Hsiu Wu