Abstract: An apparatus and a method for replacing an attachment device on a vacuum chamber is disclosed. The apparatus is constructed by the major component of two shut-off valves, a rough vacuum pump, and a pressure gauge. The attachment replacement apparatus can be advantageously connected between an attachment, such as a vacuum gauge or a flow control valve and the vacuum chamber. By utilizing the present invention novel apparatus, the down time required for replacing an attachment device on the vacuum chamber can be drastically reduced by at least 90%. For instance, only a 10 minutes down time is required by utilizing the present invention novel apparatus when compared to the conventional method which requires a 10.about.30 hour pump-down time for resuming vacuum in a chamber that has broken vacuum. The present invention novel apparatus can be used in conjunction with any type of vacuum chambers, i.e.

Abstract: This invention describes a method to monitor process parameters from multiple process machines to provide real time statistical process control (SPC). The particular implementation was derived from ion implantation of wafers, but has wide applicability where there are a number of process machines having a number of process parameters and close continuous sampling of data is required. The process parameters are collected on a single computer over a single RS 485 network, and each parameters is analyzed and displayed separately for each process and process machine. Statistical variables like Cp and Cpk arc calculated and presented on the computer screen along with graphs of the various parameters for a particular process machine. Data is aged out of the computer to an archival data base under the control of a manufacturing information system and connected to a company wide network.