Abstract: Methods of amplifying and determining a target nucleotide sequence are provided. The method of amplifying the target nucleotide sequence includes the following steps. A first adaptor and a second adaptor are linked to two ends of a double-stranded nucleic acid molecule with a target nucleotide sequence respectively to form a nucleic acid template, in which the first adaptor includes a Y-form adaptor or a hairpin adaptor and the second adaptor is a hairpin adaptor. Then, a PCR amplification cycle is performed on the nucleic acid template to obtain a PCR amplicon of the target nucleotide sequence.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.

Abstract: The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: A camera module is disclosed. The camera module includes an imager sensor device comprising a microlens array. A lens set overlies the imager sensor device. A dry film type photoresist spacer is interposed between the imager sensor device and the lens set, wherein the dry film type photoresist spacer has an opening above the microlens array. A fabrication method of the camera module is also disclosed.