Abstract: A method for CMP includes following operations. A first metal layer and a second metal layer are formed in a dielectric structure. The second metal layer is formed over a portion of the first metal layer. A first composition is provided to remove a portion of the first metal layer. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed to expose the second metal layer. A CMP operation is performed to remove a portion of the first metal layer, a portion of the second metal layer and a portion of the dielectric structure.

Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.

Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.

Abstract: A method for CMP includes following operations. A metal layer is received. A CMP slurry composition is provided in a CMP apparatus. The CMP slurry composition includes at least a first oxidizer and a second oxidizer different from each other. The first oxidizer is oxidized to form a peroxidant by the second oxidizer. A portion of the metal layer is oxidized to form a first metal oxide by the peroxidant. The first metal oxide is re-oxidized to form a second metal oxide by the second oxidizer.

Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A method for CMP includes following operations. A dielectric structure is received. The dielectric structure includes a metal layer stack formed therein. The metal layer stack includes at least a first metal layer and a second metal layer, and the first metal layer and the second metal layer are exposed through a surface of the dielectric structure. A first composition is provided to remove a portion of the first metal layer from the surface of the dielectric structure. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed from the second metal layer. A CMP operation is performed to remove a portion of the second metal layer. In some embodiments, the protecting layer protects the second metal layer during the removal of the portion of the first metal layer.

Abstract: A method for CMP includes following operations. A dielectric structure is received. The dielectric structure includes a metal layer stack formed therein. The metal layer stack includes at least a first metal layer and a second metal layer, and the first metal layer and the second metal layer are exposed through a surface of the dielectric structure. A first composition is provided to remove a portion of the first metal layer from the surface of the dielectric structure. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed from the second metal layer. A CMP operation is performed to remove a portion of the second metal layer. In some embodiments, the protecting layer protects the second metal layer during the removal of the portion of the first metal layer.

Abstract: A method for CMP includes following operations. A metal layer is received. A CMP slurry composition is provided in a CMP apparatus. The CMP slurry composition includes at least a first oxidizer and a second oxidizer different from each other. The first oxidizer is oxidized to form a peroxidant by the second oxidizer. A portion of the metal layer is oxidized to form a first metal oxide by the peroxidant. The first metal oxide is re-oxidized to form a second metal oxide by the second oxidizer.

Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.

Abstract: A textile component with collagen includes a plurality of textile members, wherein the textile member includes a first fiber component and a second fiber component. The first fiber component is composed of a fiber with collagen. The second fiber component has no fiber with collagen. The outer surface of the first fiber component and the outer surface of the second fiber component contact each other along the length direction of the first fiber component by textile spinning. The collagen can be in contact with the skin so as to contribute to the efficacies for, as example, anti-aging, skin-whitening, and wrinkles-eliminating when people wear the textile component.

Abstract: A keyboard includes a keypad portion, a base board, an illuminating device, and a circuit board. The keypad portion is mounted to the base board. The illuminating device is electrically connected to the circuit board and is further fixed to the base board surrounding the keypad portion. The circuit board is configured to supply the illuminating device with power. When powering the illuminating device, the keyboard can be used in a dark environment.

Abstract: The present invention relates to a robot with personality characters. The robot communicates with another robot within a predetermined coverage area. The robot stores at least one personality attribute of the robot, at least one personality attribute of another robot, at least one predetermined action, and a relationship among the personality attribute of the robot, the personality attribute of another robot and the predetermined action. The present invention also provides a behavior control method adapted for the robot. In the method, the robot detects a second robot within the predetermined area to obtain the personality attribute of the second robot, fetches the personality attribute of the robot, and performs the predetermined action according to the relationship.

Abstract: A toy robot includes a storage system, a player, an instruction generator, a drive module, an interface, and an update unit. The storage system is arranged for storing songs and motion control programs corresponding to each song. The player is arranged for playing the songs. The instruction generator is configured for generating motion control instructions based on the motion control programs. The drive module drives movable parts of the toy robot to execute corresponding motion patterns according to the motion control instructions. The interface is arranged for receiving motion control programs from an external electronic device. The update unit is configured for storing the motion control programs to the storage system.

Abstract: A rotating device for display panel comprises a base, a display panel set, a first driver set, and a second driver set. The first and the second driver sets installed on the base can be moved to and fro along a fixed direction. A first and a second guide portions are respectively installed in the first and the second driver sets utilized to be passed through and connected in a first and a second guide grooves disposed on the display panel set so as to form a cam structure; Whereby, when the first and the second driver sets are moved reversely, the display panel set is guided by the cam structure to rotate at an angle clockwise or counterclockwise so as to the driver sets do not need to swing and the deflection of the panel can be smoothly achieved.