Patents by Inventor Hung-Yen Lin

Hung-Yen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002684
    Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang, Liang-Guang Chen, Kei-Wei Chen, Hung Yen, Ting-Hsun Chang, Chi-Hsiang Shen, Li-Chieh Wu, Chi-Jen Liu
  • Patent number: 11977423
    Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 7, 2024
    Assignee: Dell Products L.P.
    Inventors: Hung-Pin Chien, Jyh-Yinn Lin, Yu-Wei Chi Liao, Chien Yen Hsu, Ming-Hui Pan
  • Publication number: 20240136546
    Abstract: A vacuum battery structural assembly and a vacuum multi-cell battery module composed thereof are provided and include a first repeating unit including a first frame plate and a second frame plate with respect to the first frame plate; and an electrolyte channel defined within the first frame plate and the second frame plate to accommodate a liquid electrolyte, wherein both a surface of the first frame plate and a surface of the second frame plate include a vacuum suction area, the vacuum suction area includes a vacuum aperture and a vacuum channel, wherein the vacuum aperture is formed on at least one surface of the first frame plate and the second frame plate, the vacuum channel is positioned inside the first frame plate and the second frame plate, and is configured to generate a longitudinal pressing suction force and seal the first frame plate and the second frame plate.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 25, 2024
    Inventors: Hung-Hsien Ku, Shang-Qing Zhuang, Ning-Yih Hsu, Chien-Hong Lin, Han-Jou Lin, Yi-Hsin Hu, Po-Yen Chiu, Yao-Ming Wang
  • Patent number: 7431260
    Abstract: A wafer-measuring fixture suitable for carrying a broken wafer is described. The wafer-measuring fixture comprises a base having a carrying component. The carrying component is used to hold the broken wafer. Furthermore, a plurality of scale marks is set around the carrying component to mark the broken positions on the wafer.
    Type: Grant
    Filed: September 5, 2005
    Date of Patent: October 7, 2008
    Assignee: Powerchip Semiconductor Corp.
    Inventor: Hung-Yen Lin
  • Publication number: 20070051191
    Abstract: A wafer-measuring fixture suitable for carrying a broken wafer is described. The wafer-measuring fixture comprises a base having a carrying component. The carrying component is used to hold the broken wafer. Furthermore, a plurality of scale marks is set around the carrying component to mark the broken positions on the wafer.
    Type: Application
    Filed: September 5, 2005
    Publication date: March 8, 2007
    Inventor: Hung-Yen Lin
  • Publication number: 20070025531
    Abstract: A telephone includes: an interface circuit for coupling an external line; a control circuit coupled to the interface circuit for controlling the operation of the telephone; a host device controller coupled to the control circuit, wherein the host device controller is utilized for coupling to an external storage device, and the control circuit controls the host device controller to read an audio file stored in the external storage device; an audio output device coupled to the host device controller for playing the audio file read by the host device controller; and a keypad coupled to the control circuit for dialing or inputting information into the control circuit.
    Type: Application
    Filed: November 1, 2005
    Publication date: February 1, 2007
    Inventor: Hung-Yen Lin
  • Publication number: 20070019792
    Abstract: An answering machine includes: an interface module for coupling an external line; a host device controller for coupling to an external storage device, wherein the host device controller is utilized for accessing the external storage device; a control circuit coupled to the interface module and the host device controller for controlling the host device controller to access the external storage device; and an audio output device coupled to the control circuit, wherein the audio output device is capable of being utilized for playing an audio message stored in the external storage device.
    Type: Application
    Filed: November 1, 2005
    Publication date: January 25, 2007
    Inventor: Hung-Yen Lin