Patents by Inventor Hung-Yi Chen

Hung-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12100360
    Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a light source structure and an optical film. The light source structure includes a substrate, plural light-emitting units and a package structure. The light-emitting units are disposed on the substrate. The package structure covers the light-emitting units, and the package structure has plural convex portions. The optical film is disposed on the light source structure, and the optical film is in contact with the convex portions of the package structure.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: September 24, 2024
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Jui-Lin Chen, Pin-Hsun Lee, Yuan-Jhang Chen, Che-Kai Chang, Chun-Hung Ho, Hung-Yi Chen
  • Patent number: 11825570
    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 21, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
  • Publication number: 20230360611
    Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a light source structure and an optical film. The light source structure includes a substrate, plural light-emitting units and a package structure. The light-emitting units are disposed on the substrate. The package structure covers the light-emitting units, and the package structure has plural convex portions. The optical film is disposed on the light source structure, and the optical film is in contact with the convex portions of the package structure.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Jui-Lin CHEN, Pin-Hsun LEE, Yuan-Jhang CHEN, Che-Kai CHANG, Chun-Hung HO, Hung-Yi CHEN
  • Patent number: 11551829
    Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: January 10, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hung-Yi Chen, Yen-Ching Kuo, Hong-Ming Dai, Shu-Tang Yeh, Wen-Lung Chen, Jane-Hway Liao
  • Publication number: 20220327497
    Abstract: A method for providing home care service includes steps of: obtaining profile data including a plurality of available territorial regions that are associated with a number of service providers; receiving a request for the home care service; comparing a required location included in the request with the available territorial regions to determine whether any one of the available territorial regions conforms with the required location; outputting information of a matched service provider who has the available territorial region conforming with the required location; and upon receipt of an order to designate the matched service provider, notifying the matched service provider of an assignment.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 13, 2022
    Inventors: HUNG-YI CHEN, SHIH-YUEH LIN, SHIH-HAN LIU
  • Patent number: 11424968
    Abstract: Disclosed retimer modules and methods enable equalizer training during link speed negotiation. One illustrative retimer module includes: an analog to digital converter that uses a sampling clock to digitize a receive signal; an equalizer that converts the digitized receive signal into an equalized signal; a decision element that derives a receive symbol stream from the equalized signal; and a clock recovery module that derives the sampling clock based at least in part on an equalization error of the equalized signal, the sampling clock having a frequency with a range including a baud rate of the receive signal at a first supported speed and including a frequency not less than twice the baud rate of the receive signal at a second supported speed.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: August 23, 2022
    Assignee: Credo Technology Group Limited
    Inventors: Junqing Sun, Fang Cai, Hung-Yi Chen, Haoli Qian
  • Publication number: 20220068519
    Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 3, 2022
    Inventors: Hung-Yi CHEN, Yen-Ching KUO, Hong-Ming DAI, Shu-Tang YEH, Wen-lung CHEN, Jane-Hway LIAO
  • Publication number: 20210202333
    Abstract: An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.
    Type: Application
    Filed: May 13, 2020
    Publication date: July 1, 2021
    Inventors: Hong-Ming DAI, Jane-Hway LIAO, Yen-Ching KUO, Shu-Tang YEH, Wei-Lung TSAI, Hung-Yi CHEN, Chien-Chang HUNG
  • Publication number: 20210166202
    Abstract: A method for managing a time-based currency includes steps of: receiving a credit-issuance request containing a user identifier and a value K; based on the credit-issuance request, generating a credit-issuance instruction containing the value K and a user account corresponding to the user identifier; and sending the credit-issuance instruction to a blockchain system, in order for the blockchain system to generate a transaction record in the blockchain, the transaction record indicating that K number of time credits having a base time point corresponding to a time point when the transaction record is generated have been added to the user account.
    Type: Application
    Filed: November 29, 2019
    Publication date: June 3, 2021
    Inventors: Hung-Yi CHEN, Shih-Yueh LIN, Shih-Han LIU
  • Patent number: 10985297
    Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: April 20, 2021
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
  • Publication number: 20200180057
    Abstract: An apparatus for electrochemical machining gear outline and the alignment structure thereof is disclosed, the apparatus comprises first and second alignment members. The first and second alignment members include a plurality of first alignment teeth and second alignment teeth, respectively. Recessing a gear-outline edge of the first alignment teeth by a distance and extending a gear-outline edge of the second alignment teeth by the distance for against to each other to align the first and second alignment members. A cathode electrode includes a plurality of machining teeth with both gear-outline edges recessed by the distance for against the gear-outline edge of the second alignment teeth with the extended distance to align machining teeth. Thereby, before trimming the gear-outline of a workpiece, the machining gap between the machining teeth and the teeth of the workpiece can be aligned first.
    Type: Application
    Filed: December 5, 2018
    Publication date: June 11, 2020
    Inventors: YOU-LUN CHEN, DA-YU LIN, ZHI-WEN FAN, HUNG-YI CHEN, CHEN-HUI CHANG, CHIN-HUNG WEN, CHUN-WEI CHEN
  • Publication number: 20200163166
    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
  • Publication number: 20200119240
    Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to l0 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.
    Type: Application
    Filed: May 27, 2019
    Publication date: April 16, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
  • Patent number: 10622347
    Abstract: An electrostatic discharge protection (ESD) structure for protecting a core circuit of an integrated circuit from an ESD event received by a conductive pad of the integrated circuit is provided. The ESD protection structure includes a first conductive layer, a clamp device, a first electrical connection part and a second electrical connection part. The first conductive layer is formed below the conductive pad, and includes a first conductive portion, an insulating portion and a second conductive portion. The insulating portion is surrounded by the first conductive portion and the second conductive portion. The first conductive portion is electrically connected between the conductive pad and the second conductive portion. The clamp device is arranged for clamping the ESD event. The first electrical connection part is coupled between the first conductive portion and the clamp device. The second electrical connection part is coupled between the second conductive portion and the core circuit.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: April 14, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Hung-Yi Chen, Ching-Ling Tsai
  • Publication number: 20190168326
    Abstract: The present invention relates to an electrochemical machining apparatus for gear outline, which is used for trimming the gear outline of the gear part of a workpiece and comprises a first moving mechanism, a second moving mechanism, a cathode electrode, and a gear alignment member. The cathode electrode is disposed at the first moving mechanism. The second moving mechanism is connected with the gear alignment member. The gear alignment member includes a plurality of alignment gears for aligning the location of a plurality of teeth of the gear part of the workpiece. Thereby, the plurality of teeth of the workpiece may correspond to the cathode electrode. Then, the cathode electrode may perform electrochemical machining on the plurality of teeth, and thus, trimming the outline of the plurality of teeth.
    Type: Application
    Filed: December 27, 2017
    Publication date: June 6, 2019
    Inventors: YOU-LUN CHEN, DA-YU LIN, HUNG-YI CHEN, CHEN-WEI WU, CHIN-WEI LIU, ZHI-WEN FAN, CHIU-FENG LIN
  • Publication number: 20190013309
    Abstract: An electrostatic discharge protection (ESD) structure for protecting a core circuit of an integrated circuit from an ESD event received by a conductive pad of the integrated circuit is provided. The ESD protection structure includes a first conductive layer, a clamp device, a first electrical connection part and a second electrical connection part. The first conductive layer is formed below the conductive pad, and includes a first conductive portion, an insulating portion and a second conductive portion. The insulating portion is surrounded by the first conductive portion and the second conductive portion. The first conductive portion is electrically connected between the conductive pad and the second conductive portion. The clamp device is arranged for clamping the ESD event. The first electrical connection part is coupled between the first conductive portion and the clamp device. The second electrical connection part is coupled between the second conductive portion and the core circuit.
    Type: Application
    Filed: July 6, 2017
    Publication date: January 10, 2019
    Inventors: Hung-Yi Chen, Ching-Ling Tsai
  • Patent number: 10131009
    Abstract: The present invention provides a continuous machining system, which comprises an electrochemical machining module, a separating module, and a vibration reducing module. The electrochemical machining module performs an electrochemical machining to a material strip for forming a plurality of components on the material strip. The separating module separates the plurality of components from the material strip. Thereby, the machining time is saved, and thus achieving the purposes of continuous machining and mass production. The vibration reducing module is located between the electrochemical machining module and the separating module. The vibration reducing module can ease the vibration of the material strip. Consequently, the influence of vibration on the electrochemical machining precision of the material strip machined by the electrochemical machining module may be minimized.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: November 20, 2018
    Assignee: Metal Industries Research & Development Centre
    Inventors: Hung-Yi Chen, Jung-Chou Hung
  • Publication number: 20180330675
    Abstract: A display device includes a display module, a control module, a power supply module, and a power monitoring module. The control module is signally connected to the display module. The power supply module is electrically connected to the control module. The power supply module includes an input terminal and an output terminal. The input terminal receives input electricity. The output terminal outputs output electricity to the control module. The power monitoring module is electrically connected to the power supply module and the control module. The power monitoring module monitors an output power of the output electricity and an input power of the input electricity and calculates a power loss ratio according to the output power and the input power. When the power loss ratio is less than a loss threshold, the power monitoring module generates a first notifying data according to the power loss ratio.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 15, 2018
    Inventors: Li-Wei Lin, Chen-Chiang LEE, Yank-Chin HUNG, Hung-Yi CHEN, Chih-Yuan CHEN, Wen-Hsin HUNG
  • Publication number: 20180163319
    Abstract: The present invention relates to a transmission apparatus, which comprises a base, a transmission module, a first protection sleeve, and a second protection sleeve. The transmission module is disposed on the base and includes a moving unit. The first protection sleeve is disposed around the outer periphery of the transmission module and on the base. One end of the second protection sleeve is covered by the first protection sleeve. The second protection sleeve is disposed around the moving unit and moves linkedly along the moving unit. Thereby, the transmission apparatus according to the present invention may protection the transmission module.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 14, 2018
    Inventors: YOU-LUN CHEN, DA-YU LIN, HUNG-YI CHEN, KUN-CHIN LAN, ZHI-WEN FAN, CHEN-HUI CHANG, CHIN-WEI LIU, CHEN-WEI WU
  • Publication number: 20180161898
    Abstract: The present invention relates to an electrochemical machining device, which comprises a machining electrode, a driving module, a spacer, and a conductive electrode. The machining electrode includes an electrochemical machining zone. The driving module drives the machining electrode. The spacer is adjacent to the machining electrode. The conductive electrode is adjacent to the spacer. The spacer spaces the conductive electrode and the machining electrode. When the electrochemical machining device performs electrochemical processes, the driving module drives the machining electrode and moves a machining surface of the machining electrode.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 14, 2018
    Inventors: YOU-LUN CHEN, DA-YU LIN, HUNG-YI CHEN, KUN-CHIN LAN, ZHI-WEN FAN, CHEN-HUI CHANG, CHIN-WEI LIU, CHEN-WEI WU