Patents by Inventor HUNG-YI CHIEN

HUNG-YI CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120051003
    Abstract: A printed circuit board (PCB) includes an electronic element, a signal line, an input/output (I/O) interface, and a varistor. The I/O interface is connected to the electronic element through the signal line. The varistor includes a first terminal connected to the I/O interface, and a grounded second terminal. The varistor is close to the I/O interface, to eliminate static electricity flowing into the PCB from the I/O interface.
    Type: Application
    Filed: November 24, 2010
    Publication date: March 1, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HUNG-YI CHIEN
  • Publication number: 20120043113
    Abstract: A printed circuit board (PCB) includes a ground layer, a number of conductive mount holes extending through the PCB, and a number of electromagnetic wave absorption elements located on a top surface of the PCB and aligning with corresponding mount holes. Each mount hole is lined with a conductive material to electrically connect to the ground layer. Each electromagnetic wave absorption element includes an absorption layer to absorb high-frequency noise, and a conductive layer sandwiched between the absorption layer and the top surface of the PCB, and electrically connected to a corresponding mount hole. Each conductive layer is electrically connected to the ground layer though the conductive material of the corresponding mount hole. High-frequency noise of the PCB flows into the conductive layers through the ground layer and the conductive material of the mount holes, and is absorbed by the absorption layers.
    Type: Application
    Filed: November 24, 2010
    Publication date: February 23, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HUNG-YI CHIEN
  • Publication number: 20100309602
    Abstract: A printed circuit board (PCB) includes a switch mounted on a signal layer of the PCB. A plurality of grounding copper foils are formed at opposite sides of the switch. A first end of each of the grounding copper foils is adjacent to the switch. The switch includes an electroplated button and a switch component under the electroplated button. An inner surface connected to the switch component of the electroplated button is coated with lacquer.
    Type: Application
    Filed: August 20, 2009
    Publication date: December 9, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HUNG-YI CHIEN