Abstract: A game controller includes a first control handle and a second control handle. The first control handle includes a first handle portion and a recess mount portion disposed on the first handle portion. The second control handle includes a second handle portion and a protrusion mount portion disposed on the second handle portion. The protrusion mount portion is slidably accommodated in the recess mount portion. When the game controller is in a combined mode, the first handle portion and the second handle portion are combined with each other for being cooperated with a game host. When the game controller is in a separated mode, the first handle portion is separated from the second handle portion so as to form an installation space between the first handle portion and the second handle portion for a mobile device to be installed therein.

Abstract: A game controller includes a first control handle, a second control handle and a stretchable assembly. The stretchable assembly is in a symmetrical configuration and is connected to the first control handle and the second control handle, the first control handle and the second control handle are slidable relative to each other via the stretchable assembly so as to be in a combined mode or a separated mode. When the game controller is in the combined mode, the first control handle and the second control handle are jointed with each other for being cooperated with a game console. When the game controller is in the separated mode, the first control handle and the second control handle are spaced apart from each other so as to form an installation space between the first control handle and the second control handle for a mobile device to be installed therein.

Abstract: A control device used for holding an electronic device having a display is provided. The control device includes two control handles, a connection structure, a support structure, a moving mechanism, and a movable module. The two control handles are connected to each other through the connection structure. The support structure is connected to the connection structure. The moving mechanism is connected to the support structure. The movable module includes a carrier platform and two holding assemblies. The carrier platform is connected to the support structure through the moving mechanism. The two holding assemblies are connected to the carrier platform, and the two holding assemblies are configured to cooperatively hold the electronic device that is disposed on the carrier platform. The carrier platform can be operated to move forward or backward relative to the two control handles.

Abstract: A control assembly for a portable electronic device includes a mount seat, two link portions, two controllers, and at least one multiple-angle positioning hinge. The mount seat is configured to support a portable electronic device. The link portions respectively connect to two opposite sides of the mount seat. The controllers are separated from each other and movably connected to the mount seat via the link portions. The multiple-angle positioning hinge is at least connected between the link portions and the controllers or the mount seat.

Abstract: An over-ear headphone is provided, which includes a support structure, an abutting assembly, two earcup assemblies, and two speaker modules. The support structure is an arc-shaped structure and has two free ends. The abutting assembly is disposed at an inner side of the support structure, and is used for abutting against a back portion of a head of a user. Each one of the earcup assemblies is movably connected to the support structure, and is operable to move toward or away from one of the free ends. Each one of the earcup assemblies includes an earcup that is used for covering an ear of the user. The two speaker modules are disposed in the two earcup assemblies, respectively. Through a configuration of the support structure, the over-ear headphone does not affect a hairstyle of the user.

Abstract: A method and structure for baking a wafer. A wafer is covered with a material layer and is located on a hot plate to perform a baking process. A plurality of spacers are located in between the wafer and the hot plate. The positions of the spacers are at the inner surface of the wafer and are away from the edge of the wafer. This arrangement prevents the spacer from directly contacting the edge of the wafer. A plurality of pinholes are formed on the hot plate. The spacers are located in these pinholes according to the various sizes of wafers. The number of spacers used depends on how many spacers can secure the wafer on the hot plate. The spacers have high thermal heat resistance and low conductivity. The spacers can be made of a non-metal material, for example a ceramic material or an industrial material. The spacers of the present invention have very small contact areas to allow an even distribution of temperature on the surface of the wafer.