Patents by Inventor Hung-Yi Kuo

Hung-Yi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250244527
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes an optical interposer having optical waveguides; a plurality of chip stacks disposed over the optical interposer, each of the plurality of chip stacks including a first photonic IC chip and a memory chip over the first photonic IC chip; and a plurality of first laser source chips disposed adjacent to the plurality of chip stacks, respectively, wherein the optical waveguides in the optical interposer are configured as an optical interconnect structure to couple with the memory chip through the first photonic IC chip.
    Type: Application
    Filed: April 30, 2024
    Publication date: July 31, 2025
    Inventors: Tso-Jung Chang, Chih-Peng Lin, Jeng-Shien Hsieh, Chieh-Yen Chen, Hung-Yi Kuo, Han-Jong Chia
  • Publication number: 20250246507
    Abstract: A semiconductor device includes a first interconnect structure, a device layer, a second interconnect structure, a diamond layer, a passivation layer, and an electrical connector. The device layer is disposed over the first interconnect structure. The second interconnect structure is disposed over the device layer and comprises a topmost metallization pattern. The diamond layer is disposed over the second interconnect structure and at least revealing a part of the topmost metallization pattern. The passivation layer covers the diamond layer and reveals the part of the topmost metallization pattern. The electrical connector is disposed over the passivation layer and bonded to the part of the topmost metallization pattern.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Han-Jong Chia, Yu-Jen Lien, Ke-Han Shen, Cheng-Chieh Hsieh, Kuo-Chung Yee, Szu-Wei Lu, Chung-Ju Lee, Chen-Hua Yu, Ji CUI, Chih-Ming Ke, Hung-Yi Kuo
  • Patent number: 12374627
    Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.
    Type: Grant
    Filed: June 6, 2024
    Date of Patent: July 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Yen-Liang Lin, Chun-Ti Lu, Chung-Ming Weng
  • Publication number: 20250239509
    Abstract: A plurality of processor dies may be attached to an interposer structure including interposer dielectric material layers having formed therein interposer metal interconnect structures, A dielectric matrix may be formed around the plurality of processor dies over the interposer structure. A router die may be attached to the plurality of processor dies. The router die includes router dielectric material layers having formed therein router metal interconnect structures and a router substrate having formed therein router through-substrate via structures therein. A backside of the router substrate may be thinned to expose end surfaces of the router through-substrate via structures. Memory dies may be attached to the router substrate after thinning the backside of the router substrate. Bonding pads of the memory dies are electrically connected to the router through-substrate via structures.
    Type: Application
    Filed: April 23, 2024
    Publication date: July 24, 2025
    Inventors: Han-Jong Chia, Chieh-Yen Chen, Ke-Han Shen, Hung-Yi Kuo
  • Patent number: 12360321
    Abstract: A semiconductor device includes an optical connector element and an optical coupler. The optical connector element includes a base structure, a first polymer via and a cladding layer. The base structure has a first surface and a second surface opposite to the first surface. The first polymer via passes through the base structure from the first surface to the second surface. The cladding layer is surrounding the first polymer via, wherein a refractive index of the cladding layer is different than a refractive index of the first polymer via. The optical coupler is disposed over the optical connector element, wherein the optical coupler receives optical signals from the first polymer via.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: July 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Yu-Hao Chen
  • Publication number: 20250218890
    Abstract: An integrated circuit package and the method of forming the same are provided. The integrated circuit package may comprise a substrate, a first package component bonded to the substrate and a first cooling system over the first package component. The first package component may comprise a first semiconductor die. The first cooling system may comprise a first base over the first package component, wherein the first base may comprise a first recess, a first pin protruding from a bottom of the first recess, and a first raised portion encircling the recess in a top-down view; a lid over the first base, wherein the lid may be spaced apart from the first pin; and a sealant connecting the lid to the first raised portion of the first base.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 3, 2025
    Inventors: Yu-Jen Lien, Cheng-Chieh Hsieh, Chen-Hua Yu, Ke-Han Shen, Hung-Yi Kuo
  • Patent number: 12322696
    Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: June 3, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Hsien-Ming Tu
  • Patent number: 12315784
    Abstract: A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and transistors formed at a front side of the substrate; a power distribution network, spreading at a back side of the substrate and penetrating through the substrate, to provide power and ground signals to the transistors; a dielectric material, laterally surrounding the first semiconductor die; and a second semiconductor die, having a central portion bonded with the first semiconductor die and a peripheral portion in contact with the dielectric material.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 27, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi Kuo, Cheng-Chieh Hsieh, Kuo-Chung Yee, Chen-Hua Yu
  • Publication number: 20250166895
    Abstract: A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.
    Type: Application
    Filed: January 17, 2025
    Publication date: May 22, 2025
    Inventors: Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu
  • Publication number: 20250167075
    Abstract: Semiconductor devices and methods of manufacture are presented herein. In accordance with some embodiments, a device includes a first semiconductor device, the first semiconductor device including a first interconnect structure, an integrated cooling structure bonded to the first interconnect structure, wherein the integrated cooling structure is configured for a working fluid to enter and exit the integrated cooling structure, a second semiconductor device including a second interconnect structure, the second semiconductor device bonded to the integrated cooling structure opposite the first interconnect structure, and a plurality of through substrate vias extending through the integrated cooling structure, wherein the plurality of through substrate vias electrically couple the first semiconductor device to the second semiconductor device.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 22, 2025
    Inventors: Yu-Jen Lien, Chen-Hua Yu, Cheng-Chieh Hsieh, Kuo-Chung Yee, Hung-Yi Kuo, Ke-Han Shen
  • Patent number: 12300618
    Abstract: A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die has an active surface and a back surface opposite to the active surface. The heat dissipation structure is connected to the chip package. The adapter is disposed over the first chip package and electrically connected to the semiconductor die.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: May 13, 2025
    Assignee: Taiwna Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen
  • Publication number: 20250123458
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Application
    Filed: December 18, 2024
    Publication date: April 17, 2025
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Publication number: 20250096203
    Abstract: A manufacturing method of a semiconductor package includes the following steps. A first lower semiconductor device and a second lower semiconductor device are provided. A plurality of first conductive pillars are formed on the first lower semiconductor device along a first direction parallel to a side of the first lower semiconductor device. A plurality of second conductive pillars are formed on the second lower semiconductor device along a second direction parallel to a side of the second lower semiconductor device, wherein the first direction is substantially collinear with the second direction. An upper semiconductor device is disposed on the first lower semiconductor device and the second lower semiconductor device and revealing a portion where the plurality of first conductive pillars and the plurality of second conductive pillars are disposed.
    Type: Application
    Filed: November 7, 2024
    Publication date: March 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo-Lung Pan, Ting Hao Kuo, Yu-Chia Lai, Mao-Yen Chang, Po-Yuan Teng, Shu-Rong Chun
  • Patent number: 12243681
    Abstract: A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu
  • Publication number: 20250070013
    Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.
    Type: Application
    Filed: November 14, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Hsiu-Jen Lin, Ming-Che Ho, Yu-Hsiang Hu, Chewn-Pu Jou, Cheng-Tse Tang
  • Publication number: 20250060542
    Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.
    Type: Application
    Filed: November 3, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Chung-Ming Weng
  • Patent number: 12222545
    Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: February 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Patent number: 12210188
    Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
  • Patent number: 12210200
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: February 26, 2024
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu