Abstract: In some embodiments, the present disclosure relates to an integrated device, including a substrate comprising a channel region; a gate structure disposed on the substrate over the channel region; a first doped region of a first doping type on a first side of the gate structure; a second doped region of the first doping type on a second side of the gate structure; a shallow trench isolation (STI) structure disposed on an opposite side of the first doped region from the gate structure and having a bottom surface at a first depth beneath a top surface of the substrate; a shallow-shallow trench isolation (SSTI) structure extending from the second doped region to the gate structure, the SSTI structure having a bottom surface at a second depth beneath the top surface of the substrate, where the second depth is less than the first depth.

Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.

Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.