Patents by Inventor Hung-Yu Liu
Hung-Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11947251Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.Type: GrantFiled: March 23, 2022Date of Patent: April 2, 2024Assignee: Coretronic CorporationInventors: Chi-Fu Liu, Tsung-Hsin Liao, Chun-Li Chen, Hung-Yu Lin
-
Patent number: 11947153Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.Type: GrantFiled: May 4, 2023Date of Patent: April 2, 2024Assignee: Radiant Opto-Electronics CorporationInventors: Hung-Pin Cheng, Shih-Fan Liu, Chien-Yu Ko, Jui-Lin Chen
-
Publication number: 20240106104Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.Type: ApplicationFiled: September 8, 2023Publication date: March 28, 2024Applicant: COMPAL ELECTRONICS, INC.Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
-
Publication number: 20240087891Abstract: A method of patterning a substrate includes forming a first line, a second line, and a third line over the substrate, the first line, the second line, and the third line being parallel in a plan view, and forming a fourth line and a fifth line over the first line, the second line, and the third line, the fourth line and the fifth line being orthogonal to the first line in the plan view. The method further includes etching a hole through the second line using the first line, the third line, the fourth line, and the fifth line as an etching mask, and filling the hole with a dielectric material to form a block.Type: ApplicationFiled: September 13, 2022Publication date: March 14, 2024Inventors: Eric Chih-Fang Liu, Shihsheng Chang, Kai-Hung Yu, Yun Han
-
Patent number: 11917340Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.Type: GrantFiled: March 24, 2022Date of Patent: February 27, 2024Assignee: Coretronic CorporationInventors: Chi-Fu Liu, Tsung-Hsin Liao, Chun-Li Chen, Hung-Yu Lin
-
Patent number: 11914277Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.Type: GrantFiled: January 18, 2022Date of Patent: February 27, 2024Assignee: Coretronic CorporationInventors: Hung-Yu Lin, Chi-Fu Liu, Chun-Hsin Lu, Chun-Li Chen
-
Publication number: 20230168361Abstract: A method for recognizing a motion state of an object by using a millimeter wave radar having at least one antenna is disclosed. The method includes the following steps. A region is set to select an object in the region, wherein the object has M ranges and M azimuths between the object and the at least one antenna during a first motion time. Each of the M ranges and the M azimuths are projected on a two-dimensional (2D) plane to form M frames. The M frames are sequentially arranged into a first consecutive candidate frames having a time sequence. The first consecutive candidate frames are inputted into an artificial intelligence model to determine a motion state type of the first consecutive candidate frames.Type: ApplicationFiled: April 6, 2022Publication date: June 1, 2023Inventors: Jiun-In Guo, Hung-Yu Liu
-
Patent number: 10753899Abstract: A whole blood measurement method associated to hematocrit (HCT) and a whole blood measurement circuit thereof is applied in the detection of HCT of a whole blood sample to be tested. Herein, a time to digital converting circuit (TDC) is used for counting charging time or discharging time of a fixed capacitor and a to-be-tested sample, and a capacitance difference that is related to HCT is generated according to the charging time or the discharging time, so as to provide a reference for a whole blood feature test.Type: GrantFiled: November 1, 2018Date of Patent: August 25, 2020Assignee: HOLTEK SEMICONDUCTOR INC.Inventors: Kuo-Hsiang Chen, Kuo-Yang Li, Hung-Yu Liu
-
Publication number: 20190072512Abstract: A whole blood measurement method associated to hematocrit (HCT) and a whole blood measurement circuit thereof is applied in the detection of HCT of a whole blood sample to be tested. Herein, a time to digital converting circuit (TDC) is used for counting charging time or discharging time of a fixed capacitor and a to-be-tested sample, and a capacitance difference that is related to HCT is generated according to the charging time or the discharging time, so as to provide a reference for a whole blood feature test.Type: ApplicationFiled: November 1, 2018Publication date: March 7, 2019Applicant: HOLTEK SEMICONDUCTOR INC.Inventors: Kuo-Hsiang CHEN, Kuo-Yang LI, Hung-Yu LIU
-
Patent number: 10151721Abstract: A whole blood measurement method associated to hematocrit (HCT) and a whole blood measurement circuit thereof is applied in the detection of HCT of a whole blood sample to be tested. Herein, a time to digital converting circuit (TDC) is used for counting charging time or discharging time of a fixed capacitor and a to-be-tested sample, and a capacitance difference that is related to HCT is generated according to the charging time or the discharging time, so as to provide a reference for a whole blood feature test.Type: GrantFiled: July 28, 2016Date of Patent: December 11, 2018Assignee: HOLTEK SEMICONDUCTOR INC.Inventors: Kuo-Hsiang Chen, Kuo-Yang Li, Hung-Yu Liu
-
Publication number: 20170350844Abstract: A whole blood measurement method associated to hematocrit (HCT) and a whole blood measurement circuit thereof is applied in the detection of HCT of a whole blood sample to be tested. Herein, a time to digital converting circuit (TDC) is used for counting charging time or discharging time of a fixed capacitor and a to-be-tested sample, and a capacitance difference that is related to HCT is generated according to the charging time or the discharging time, so as to provide a reference for a whole blood feature test.Type: ApplicationFiled: July 28, 2016Publication date: December 7, 2017Applicant: HOLTEK SEMICONDUCTOR INC.Inventors: Kuo-Hsiang CHEN, Kuo-Yang LI, Hung-Yu LIU
-
Patent number: 5782997Abstract: Single crystal aluminum is deposited on SiGe structures to form metal interconnects. Generally, a method of forming single crystal aluminum on Si.sub.(1-X) Ge.sub.X is presented, including the steps of maintaining the substrate at certain temperature (e.g. between 300.degree. C. and 400.degree. C.) and pressure conditions (e.g. below 2.times.10.sup.-9 millibar) while aluminum atoms are deposited by a vacuum evaporation technique. This is apparently the first method of depositing single crystal aluminum on SiGe surfaces. Novel structures are made possible by the invention, including epitaxial layers 34 formed on single crystal aluminum 32 which has been deposited on SiGe 30. Among the advantages made possible by the methods presented are thermal stability and resistance to electromigration.Type: GrantFiled: June 7, 1995Date of Patent: July 21, 1998Assignee: Texas Instruments IncorporatedInventors: Chih-Chen Cho, Hung-Yu Liu
-
Patent number: 5501174Abstract: Single crystal aluminum is deposited on SiGe structures to form metal interconnects. Generally, a method of forming single crystal aluminum on Si.sub.(1-x) Ge.sub.x is presented, including the steps of maintaining the substrate at certain temperature (e.g. between 300.degree. C. and 400.degree. C.) and pressure conditions (e.g. below 2.times.10.sup.-9 millibar) while aluminum atoms are deposited by a vacuum evaporation technique. This is apparently the first method of depositing single crystal aluminum on SiGe surfaces. Novel structures are made possible by the invention, including epitaxial layers 34 formed on single crystal aluminum 32 which has been deposited on SiGe 30. Among the advantages made possible by the methods presented are thermal stability and resistance to electromigration.Type: GrantFiled: April 7, 1994Date of Patent: March 26, 1996Assignee: Texas Instruments IncorporatedInventors: Chih-Chen Cho, Hung-Yu Liu
-
Patent number: 5229333Abstract: In one form of the invention, a method is disclosed for growing CaF.sub.2 on a silicon surface, comprising the steps of maintaining the silicon surface at a first temperature below approximately 500.degree. C., starting a deposition of CaF.sub.2 on the silicon surface, stopping the deposition, and then annealing the CaF.sub.2 in forming gas at a temperature below 600.degree. C.Type: GrantFiled: February 28, 1992Date of Patent: July 20, 1993Assignee: Texas Instruments IncorporatedInventors: Chih-Chen Cho, Tae S. Kim, Bruce E. Gnade, Yasushiro Nishioka, Hung-Yu Liu