Abstract: An integrated RF front-end architecture is disclosed. Such an integrated RF front-end architecture includes a multi-tap balun, a low noise amplifier and a power amplifier core. The multi-tap balun includes a single-ended primary winding and a symmetrical multi-tap secondary winding, wherein the single-ended primary winding is operably coupled to an antenna. The low noise amplifier is coupled to a first set of taps of the symmetrical multi-tap secondary winding. The power amplifier core is coupled to a second set of taps of the symmetrical multi-tap secondary winding and can be a two stage amplifier having a driver stage and an output stage. The multi-tap balun, low noise amplifier and power amplifier core can be on-chip components or can be fabricated to be discrete components on a printed circuit board.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip differential inductor includes a 1st interwound winding having a substantially octagonal shape, or rectangular octagonal shape, and a 2nd interwound winding having a substantially octagonal shape, or rectangular octagonal shape, that is interwound with the 1st interwound winding. Both the 1st and 2nd interwound windings are on the same layer of the integrated circuit. Each interwound winding includes two nodes; one of node of each winding is commonly coupled to a reference potential. The other node of each winding is operably coupled to receive a respective leg of a differential signal.

Abstract: A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the, primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Abstract: An integrated RF front-end architecture is disclosed. Such an integrated RF front-end architecture includes a multi-tap balun, a low noise amplifier and a power amplifier core. The multi-tap balun includes a single-ended primary winding and a symmetrical multi-tap secondary winding, wherein the single-ended primary winding is operably coupled to an antenna. The low noise amplifier is coupled to a first set of taps of the symmetrical multi-tap secondary winding. The power amplifier core is coupled to a second set of taps of the symmetrical multi-tap secondary winding and can be a two stage amplifier having a driver stage and an output stage. The multi-tap balun, low noise amplifier and power amplifier core can be on-chip components or can be fabricated to be discrete components on a printed circuit board.

Abstract: A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the, primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Abstract: A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Abstract: A transformer balun is obtained that is symmetrical in structure, provides high current, or high voltage, amplification and has high coupling coefficients while maintaining minimal overall size. The balun structure includes primary and secondary metal windings at separate layer interfaces. The primary and secondary metal windings are symmetrical and can have any number of turns, which is only limited by integrated circuit area and capacitance. Accordingly, the primary and secondary windings may be on as many layers as needed. Further, the primary and/or secondary may include a center tap ground, which enables the winding to be used as a differential port.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip multiple tap transformed balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip differential inductor includes a 1st interwound winding having a substantially octagonal shape, or rectangular octagonal shape, and a 2nd interwound winding having a substantially octagonal shape, or rectangular octagonal shape, that is interwound with the 1st interwound winding. Both the 1st and 2nd interwound windings are on the same layer of the integrated circuit. Each interwound winding includes two nodes; one of node of each winding is commonly coupled to a reference potential. The other node of each winding is operably coupled to receive a respective leg of a differential signal.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: A structure for an infrared ray communication device placed over a lane which encloses a wireless infrared communication device and includes an upper cover for an attachment lens, an attachment lens, a rain shield, a light guiding device, a fixed support for an emitting module, a fixed support for a receiving module, a circuit board socket, a trough for a transformer, fixed hooks, and a rain shield. The device is placed over a path of a passing vehicle, and used to receive infrared rays and to proceed with data transmission.