Abstract: In examples, a package comprises a semiconductor die having a device side comprising circuitry formed therein. The package comprises a planarized passivation layer abutting the device side and a horizontal metal member coupled to the device side by way of vias extending through the passivation layer. The horizontal metal member has a thickness ranging between 4 microns and 25 microns. The package also comprises a metal post coupled to and vertically aligned with the horizontal metal member without a sputtered seed layer between the metal post and the horizontal metal member. The metal post has a vertical thickness ranging between 10 microns and 80 microns. The package also comprises a polyimide (PI) layer contacting the metal post, the horizontal metal member, and the passivation layer. The PI layer is not positioned between the metal post and the horizontal metal member. A thickness of a thickest portion of the PI layer ranges between 3 microns and 80 microns.

Abstract: An integrated circuit (IC) includes semiconductor substrate with a metal stack including a lower, upper and a top metal layer that includes bond pads and a detection bond pad (DBP). A wirebond damage detector (WDD) includes the DBP over a first and second connected structure. The first and second connected structures both include spaced apart top segments of the upper metal layer coupled to spaced apart bottom segments of the lower metal layer. The DBP is coupled to one end of the first connected structure, and ?1 metal trace is coupled to another end extending beyond the DBP to a first test pad. The second connected structure includes metal traces coupled to respective ends each extending beyond the DBP to a second test pad and to a third test pad.

Abstract: In some examples, a package comprises a die having a device side with circuitry formed therein; a passivation layer abutting the device side; and first and second vias coupling to the device side and extending through the passivation layer. The package includes first and second metal layers coupled to the first and second vias, respectively, the first and second metal layers abutting the passivation layer. The package includes an insulation layer abutting the first and second metal layers and separating the first and second metal layers, the insulation layer having an orifice in vertical alignment with the second metal layer. The package includes a third metal layer coupled to the second metal layer through the orifice, the third metal layer vertically aligned with the first and second metal layers. The package comprises a conductive member coupled to the third metal layer. The package includes a mold compound covering package components.

Abstract: The present disclosure provides a lipid nanoparticle and uses of the lipid nanoparticle for treating cancer, targeting integrin ?v?3, anti-angiogenesis to prevent cancer metastasis and reducing the cytotoxicity of anti-cancer drugs to normal cells. In addition, since it can inhibit angiogenesis, it also can be used in vascular related diseases. The lipid nanoparticle provides targeting cell surface integrin ?v?3, the nano-liposome specific against digestion system-related cancers locally and systemically. The lipid nanoparticle of the present disclosure would target cancer cells instead of normal cells. Even normal cells contain integrin ?v?3, however, the lipid nanoparticle of the present disclosure only recognizes the conformation of integrin ?v?3 on the cancer cells. The lipid nanoparticle of the present disclosure can equip with other targeting molecules, payload with other anti-cancer drugs, and can combine with radiation therapy and reduce radiation therapeutic threshold.

Abstract: An integrated circuit (IC) includes semiconductor substrate with a metal stack including a lower, upper and a top metal layer that includes bond pads and a detection bond pad (DBP). A wirebond damage detector (WDD) includes the DBP over a first and second connected structure. The first and second connected structures both include spaced apart top segments of the upper metal layer coupled to spaced apart bottom segments of the lower metal layer. The DBP is coupled to one end of the first connected structure, and >1 metal trace is coupled to another end extending beyond the DBP to a first test pad. The second connected structure includes metal traces coupled to respective ends each extending beyond the DBP to a second test pad and to a third test pad.

Abstract: An integrated circuit (IC) includes semiconductor substrate with a metal stack including a lower, upper and a top metal layer that includes bond pads and a detection bond pad (DBP). A wirebond damage detector (WDD) includes the DBP over a first and second connected structure. The first and second connected structures both include spaced apart top segments of the upper metal layer coupled to spaced apart bottom segments of the lower metal layer. The DBP is coupled to one end of the first connected structure, and ?1 metal trace is coupled to another end extending beyond the DBP to a first test pad. The second connected structure includes metal traces coupled to respective ends each extending beyond the DBP to a second test pad and to a third test pad.

Abstract: An integrated circuit (IC) includes semiconductor substrate with a metal stack including a lower, upper and a top metal layer that includes bond pads and a detection bond pad (DBP). A wirebond damage detector (WDD) includes the DBP over a first and second connected structure. The first and second connected structures both include spaced apart top segments of the upper metal layer coupled to spaced apart bottom segments of the lower metal layer. The DBP is coupled to one end of the first connected structure, and ?1 metal trace is coupled to another end extending beyond the DBP to a first test pad. The second connected structure includes metal traces coupled to respective ends each extending beyond the DBP to a second test pad and to a third test pad.

Abstract: Provided herein is a continuous cell perfusion model system that provides useful pharmacokinetic and pharmacodynamic information on the application of new drugs or combinations of various agents in vitro to human cancer cell lines. Also provided are methods of using this system to individualize cancer treatment.

Abstract: Provided herein are compositions and methods for treating cancer by increasing the inhibitory effect of cetuximab on HIF1? expression by administering cetuximab in combination with anti-angiogenic thyroid hormone analogs such as tetrac or triac.

Abstract: Prostaglandin-endoperoxide H synthase (PGHS-2) converts arachidonic acid to prostaglandin H2. PGHS-2 is an inducible gene product undetectable in most normal human tissues, but abundant in cancer cells. The present invention exploits a previously undisclosed transcriptional function of PGHS-2 distinct from its well-established enzymatic role to identify potential therapeutic agents useful in treating cancer. The method comprises a DNA binding assay in which PGHS-2 protein binding to the C/EBP, CRE and NF-?B regions of the PGHS-2 promoter in the presence and absence of test compounds is evaluated to identify inhibitors of PGHS-2 transactivation activity.

Abstract: Provided herein are compositions and methods for treating cancer by increasing the inhibitory effect of cetuximab on HIF1? expression by administering cetuximab in combination with anti-angiogenic thyroid hormone analogs such as tetrac or triac.

Abstract: Provided herein are compositions and methods for treating cancer by increasing the pro-apototic actions of small molecule ligands of integrin RGD recognition sites such as polyphenols by administering such compounds in conjunction with anti-angiogenic thyroid hormone analogs such as tetrac or triac.

Abstract: Prostaglandin-endoperoxide H synthase (PGHS-2) converts arachidonic acid to prostaglandin H2. PGHS-2 is an inducible gene product undetectable in most normal human tissues, but abundant in cancer cells. The present invention exploits a previously undisclosed transcriptional function of PGHS-2 distinct from its well-established enzymatic role to identify potential therapeutic agents useful in treating cancer. The method comprises a DNA binding assay in which PGHS-2 protein binding to the C/EBP, CRE and NF-?B regions of the PGHS-2 promoter in the presence and absence of test compounds is evaluated to identify inhibitors of PGHS-2 transactivation activity.