Patents by Inventor Hungl WU

Hungl WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile acoustic module
    Patent number: 12302051
    Abstract: A low profile acoustic module is described. Embodiments include a headset acoustic module having first and second chambers. The first chamber has a side wall and first portion of a back wall, and defining a first volume. The side wall defines an opening sized to retain a speaker, and the first chamber defines a first volume. The second chamber is adjacent the first chamber, and comprises an inner wall, a front wall, and a second portion of the back wall, and defining a second volume greater than the first volume. The second volume is fluidly coupled to the first volume via a first set of vents on the inner wall, the second volume is fluidly coupled to an ambient atmosphere via a second set of vents, and the inner wall comprises at least a portion of the side wall.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: May 13, 2025
    Assignee: Logitech Europe S.A.
    Inventors: Daniel Ryan Marquez, WeiJen Cheng, Hungl Wu
  • LOW PROFILE ACOUSTIC MODULE
    Publication number: 20240365039
    Abstract: A low profile acoustic module is described. Embodiments include a headset acoustic module having first and second chambers. The first chamber has a side wall and first portion of a back wall, and defining a first volume. The side wall defines an opening sized to retain a speaker, and the first chamber defines a first volume. The second chamber is adjacent the first chamber, and comprises an inner wall, a front wall, and a second portion of the back wall, and defining a second volume greater than the first volume. The second volume is fluidly coupled to the first volume via a first set of vents on the inner wall, the second volume is fluidly coupled to an ambient atmosphere via a second set of vents, and the inner wall comprises at least a portion of the side wall.
    Type: Application
    Filed: April 26, 2023
    Publication date: October 31, 2024
    Applicant: Logitech Europe S.A.
    Inventors: Daniel Ryan MARQUEZ, WeiJen CHENG, Hungl WU