Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

Abstract: An advanced electrodeposited copper foil having island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into island-shaped patterns.

Abstract: An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-rough surface includes multiple copper nodule-free areas and copper nodule-arranged areas. The micro-rough surface of 120 ?m2 has at least five copper nodule-free areas of 62500 nm2 or more. Each copper nodule-arranged area has a length of 300 nm to 2500 nm and includes three to fifty copper nodules with a mean width of 10 nm to 300 nm. Besides, the micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface profile and/or characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.

Abstract: An advanced electrodeposited copper foil having long and island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into a long and island-shaped pattern.

Abstract: An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

Abstract: A high-speed connector includes an insulating body, an insulating cap, two terminal sets and two shielding sheets. The insulating body includes a body portion and a tongue plate. The tongue plate divides the interior of the body portion into two accommodating spaces. The insulating cap is fitted around the front end of the tongue plate of the insulating body. Each of the two terminal sets includes a terminal base and a plurality of terminals. The two shielding sheets are disposed on one side of each of the two terminal sets respectively. A plurality of ground ports is disposed on one side of each shielding sheet respectively, in which the plurality of ground ports contacts the plurality of ground terminals of the plurality of terminals of each terminal set so that the two shielding sheets form ground shielding with the ground terminals of each terminal set respectively.

Abstract: A high frequency signal communication connector with improved crosstalk performance includes an insulated housing, a plurality of first terminals, a plurality of second terminals, a conductive shielding layer, and a metal shell. The insulated housing has two inserting slots. The first and second terminals are disposed in the insulated housing, and have front ends respectively extending into the two inserting slots, and rear ends respectively extending outside a bottom of the insulated housing. The conductive shielding layer is provided on the insulated housing, and is disposed with a plurality of through holes. The first and second terminals respectively pass through the through holes, so that the conductive shielding layer covers a part of the first and second terminals. The first and second terminals have grounding terminals contacting with the conductive shielding layer, so that the terminals have better shielding effectiveness to reduce crosstalk interference.

Abstract: A high frequency connector with enhanced grounding for reduced crosstalk includes an insulative main body, a plurality of first terminals and second terminals, a back cover and a grounding member. The first terminals and the second terminals are disposed in the insulative main body, the back cover is provided at the second end of the insulative main body. The back cover is formed with an opening and capable of preventing the first terminals from being detached from the insulative main body. The grounding member has a body portion and contact sprint portion, the body portion is disposed inside the insulative main body and located between the first terminals and second terminals. The contact spring portion extends outward from the insulative main body and contacts the metal case of a mating plug connector for reducing crosstalk and restraining electromagnetic interference.

Abstract: A high frequency connector with enhanced grounding for reduced crosstalk includes an insulative main body, a plurality of first terminals and second terminals, a back cover and a grounding member. The first terminals and the second terminals are disposed in the insulative main body, the back cover is provided at the second end of the insulative main body. The back cover is formed with an opening and capable of preventing the first terminals from being detached from the insulative main body. The grounding member has a body portion and contact sprint portion, the body portion is disposed inside the insulative main body and located between the first terminals and second terminals. The contact spring portion extends outward from the insulative main body and contacts the metal case of a mating plug connector for reducing crosstalk and restraining electromagnetic interference.

Abstract: A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.

Abstract: The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine.

Abstract: A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.

Abstract: A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.

Abstract: The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine.