Patents by Inventor Huo-Kang HSU
Huo-Kang HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230065896Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.Type: ApplicationFiled: July 1, 2022Publication date: March 2, 2023Applicant: MPI CorporationInventors: Yi-Chien Tsai, Huo-Kang Hsu, Yu-Wen Chou, Yu-Shan Hu
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Patent number: 11402407Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.Type: GrantFiled: December 10, 2020Date of Patent: August 2, 2022Assignee: MPI CorporationInventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang
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Patent number: 11150269Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.Type: GrantFiled: August 11, 2020Date of Patent: October 19, 2021Assignee: MPI CORPORATIONInventors: Hui-Pin Yang, Shang-Jung Hsieh, Yu-Wen Chou, Ching-Fang Yu, Huo-Kang Hsu, Chin-Tien Yang
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Publication number: 20210181237Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.Type: ApplicationFiled: December 10, 2020Publication date: June 17, 2021Inventors: Zhi-Wei SU, Tzung-Je TZENG, Wen-Chi CHEN, Huo-Kang HSU, Hsueh-Chih WU, Sheng-Wei LIN, Chin-Yi LIN, Che-Wei LIN, Jian-Kai HONG, Shu-Jui CHANG
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Publication number: 20210048452Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.Type: ApplicationFiled: August 11, 2020Publication date: February 18, 2021Applicant: MPI CORPORATIONInventors: Hui-Pin YANG, Shang-Jung HSIEH, Yu-Wen CHOU, Ching-Fang YU, Huo-Kang HSU, Chin-Tien YANG
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Patent number: 9643271Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.Type: GrantFiled: January 20, 2015Date of Patent: May 9, 2017Assignee: MPI CorporationInventors: Kun-Han Hsieh, Huo-Kang Hsu, Kuan-Chun Chou, Tsung-Yi Chen, Chung-Tse Lee
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Patent number: 9442135Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.Type: GrantFiled: March 25, 2014Date of Patent: September 13, 2016Assignee: MPI CORPORATIONInventors: Kuan-Chun Chou, Huo-Kang Hsu, Hui-Pin Yang, Chien-Kuei Wang
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Publication number: 20150206850Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.Type: ApplicationFiled: January 20, 2015Publication date: July 23, 2015Inventors: Kun-Han HSIEH, Huo-Kang HSU, Kuan-Chun CHOU, Tsung-Yi CHEN, Chung-Tse LEE
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Publication number: 20140290053Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.Type: ApplicationFiled: March 25, 2014Publication date: October 2, 2014Applicant: MPI CORPORATIONInventors: Kuan-Chun CHOU, Huo-Kang HSU, Hui-Pin YANG, Chien-Kuei WANG