Patents by Inventor Huobing Huang

Huobing Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY
    Publication number: 20220293488
    Abstract: A heat sink for an IC component and an IC heat sink assembly are provided. The heat sink for an IC component has a contact surface suitable for thermally contacting with the IC component. A groove is provided in the contact surface. The IC heat sink assembly includes: a heat sink for an IC component; an IC component thermally connected to the heat sink; and a thermally conductive interface material provided between the heat sink and the IC component.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 15, 2022
    Inventors: Jinqiang CHU, Mieslinger ALEXANDER, Jiale WU, Huobing HUANG
  • Electronic device and waterproof structure for electronic device
    Patent number: 11363732
    Abstract: Disclosed are an electronic device and a waterproof structure for the electronic device. The waterproof structure for the electronic device includes: an outer housing having a housing opening; and an electronic device housing at least partially mounted in the outer housing through the housing opening, wherein the electronic device housing has an electronic device housing surface, the housing opening has an opening surface opposite to the electronic device housing surface, and the electronic device housing surface and the opening surface are spaced apart to define a gap therebetween, and wherein one of the electronic device housing surface and the opening surface defines a longitudinally extending groove, and an opening of the groove is orientated toward the other one of the electronic device housing surface and the opening surface.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: June 14, 2022
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Haifeng Lu, Ying Zhang, Huobing Huang, Meiqi Wang
  • ELECTRONIC DEVICE AND WATERPROOF STRUCTURE FOR ELECTRONIC DEVICE
    Publication number: 20210092857
    Abstract: Disclosed are an electronic device and a waterproof structure for the electronic device. The waterproof structure for the electronic device includes: an outer housing having a housing opening; and an electronic device housing at least partially mounted in the outer housing through the housing opening, wherein the electronic device housing has an electronic device housing surface, the housing opening has an opening surface opposite to the electronic device housing surface, and the electronic device housing surface and the opening surface are spaced apart to define a gap therebetween, and wherein one of the electronic device housing surface and the opening surface defines a longitudinally extending groove, and an opening of the groove is orientated toward the other one of the electronic device housing surface and the opening surface.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Inventors: Haifeng Lu, Ying Zhang, Huobing Huang, Meiqi Wang