Patents by Inventor Huong Do

Huong Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070218258
    Abstract: In general the disclosure relates to manufacturing methods for producing conductive patterns on flexible substrates. For example, a layer of a metal powder composition is deposited onto an adhesive overlaying a substrate. Pressure is applied to the metal powder composition on the adhesive coated substrate web by a die having one or more projections, in order to reproduce a pattern on the substrate. The metal powder is compressed by the projections of the die, thereby densifying the powder and causing it to adhere to the adhesive in a reproduction of the die pattern. The metal powder does not adhere substantially in uncompressed regions, and may be removed. In this manner, a metal powder composition may be densified and adhered to a substrate forming a web of flexible circuit elements, for example, circuit elements such as antennas, resistors, capacitors, inductive coils, conduction pads and the like.
    Type: Application
    Filed: March 20, 2006
    Publication date: September 20, 2007
    Inventors: Terry Nees, Thanh-Huong Do, Steven Hackett, Matthew Michel, Katherine Brown
  • Publication number: 20050193010
    Abstract: The present invention describes a system and method of managing digital content received from content providers and for facilitating access to the digital content to many subscribers. The method includes receiving from the content providers incoming feed files where each feed file contains information describing the content. The method determines if the feed files are approved by applying a template to the feed files and also receives request files from the subscribers where each request file contains search criteria. The method provides one or more answer files in response to the request files where each answer file identifies feed files that meet the search criteria of a corresponding request file. The answer files are used to access or permit access to digital content on the web. In addition, a graphical user interface is described to manage, edit, promote and delete the feed files provided to the system.
    Type: Application
    Filed: February 27, 2004
    Publication date: September 1, 2005
    Inventors: Jay DeShan, Chad Gray, Huong Do
  • Patent number: 6303871
    Abstract: An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern occurs in two substantially perpendicular directions. Traces between the metal layers have reduced impedance variation due to the degassing hole pattern.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: October 16, 2001
    Assignee: Intel Corporation
    Inventors: Longqiang Zu, Huong Do
  • Patent number: 5399517
    Abstract: In a method for providing routing between logic cells, the logic cells are arranged in rows. Intercell connectors within each row of logic cells are aligned, for example in the middle of the rows, to form channel boundaries. The intercell connectors are then channel routed in metal layers above the logic cells. Alternately, intercell connectors are placed within the logic cells, however, these intercell connectors are not necessarily aligned. For each intercell connector which is not on a boundary of a routing channel, a substitute connector is located at the boundary of a routing channel. The substitute connectors and the intercell connectors which are on the boundaries of the routing channels are channel routed. Length of routing segments are then adjusted to substitute connectors to extend to intercell connectors instead of the substitute connectors.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: March 21, 1995
    Assignee: VLSI Technology, Inc.
    Inventors: Sunil Ashtaputre, Mark Hartoog, Kieu-Huong Do, Prasad Sakhamuri, Charles Ng
  • Patent number: 5353235
    Abstract: A method of routing interconnections of devices in a planar field by the use of a computer. The method effectively shortens the length of all interconnections, including interconnections which connect points on the same device, in accordance with design rules. Also, the layers constituting the planar field can be assigned weights to effectively minimize the appearance of interconnections in the layer having the highest assigned weight.
    Type: Grant
    Filed: June 17, 1992
    Date of Patent: October 4, 1994
    Assignee: VLSI Technology, Inc.
    Inventors: Kieu-Huong Do, Sunil Ashtaputre