Patents by Inventor Huong Kim Lam

Huong Kim Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process to remove semiconductor chips from a plastic package
    Patent number: 6429028
    Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: August 6, 2002
    Assignee: DPA Labs, Incorporated
    Inventors: Philip Young, Douglas Young, Scott McDaniel, Gary Bivins, William S. Ditto, Huong Kim Lam
  • Process to remove semiconductor chips from a plastic package
    Publication number: 20020048825
    Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.
    Type: Application
    Filed: August 23, 2001
    Publication date: April 25, 2002
    Inventors: Phillip Young, Douglas Young, Scott McDaniel, Gary Bivins, William S. Ditto, Huong Kim Lam