Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.

Abstract: The present disclosure relates to thermal management systems in an electronic device. In particular, the systems described herein provide a microfluidic channel between a first die and a second die that acts as an insulating layer between the first die and the second die to prevent heat transfer between the two dies. The systems described herein further provide a first inlet for the first die configured to receive a first working fluid at a first temperature, and a second inlet for the second die configured to receive a second working fluid at a second temperature, therefore providing heterogenous cooling for each die in an integrated chip package.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: Techniques for increasing an atomic surface area of contact surfaces of an energy source to cause the energy source to increase its energy output are disclosed. An energy source includes first and second contact surfaces, where these contact surfaces are structured to facilitate energy transfer between the energy source and a receiving unit. The contact surfaces each have a first surface area state with a first amount of atomic surface area. A process is applied to the contact surfaces to change the first surface area state to a second surface area state. The second surface area state has a second amount of atomic surface area which is more than the first amount of atomic surface area. The applied process may include applying a current or applying a short to the contact surfaces.

Abstract: An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

Abstract: A system may model a thermal management demand of a heat-generating component on an outer surface of the heat-generating component as a heat generation map. A system may select an initial channel design based on the heat generation map. A system may evaluate the initial channel design, wherein evaluated metrics include at least pressure drop and thermal resistance of the channel design. A system may change at least one parameter of the initial channel design based on the evaluated metrics to create a refined channel design. A system may form at least one thermal element in or on the outer surface of the heat-generating component according to the refined channel design.

Abstract: Described are examples for improving heat transfer for a data center, which may include a hermetically sealed container having sides defining an interior portion that is able to hold pressurized gas or air, a data center computer server located within the interior portion, and a spray device located within the interior portion for spraying a non-corrosive fluid over the data center computer server to, in conjunction with the pressurized gas or air, cool at least a portion of the data center computer server.

Abstract: Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.

Abstract: A processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by the first surface of the substrate, and the microfluidic volume is positioned in the second surface of the substrate. The processing unit includes a first electrode positioned in the microfluidic volume and a second electrode positioned in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is positioned in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.