Patents by Inventor Husam Atallah ALISSA

Husam Atallah ALISSA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11801470
    Abstract: A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: October 31, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Mark Alan Monroe, Bharath Ramakrishnan, Vaidehi Oruganti
  • Publication number: 20230338948
    Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Christian L. BELADY, Dennis TRIEU
  • Publication number: 20230345673
    Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Dennis TRIEU, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Kathryn M. OSEEN-SENDA, Douglas Patrick KELLEY, Alexis Grace SCHUBERT
  • Publication number: 20230341910
    Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Christian L. BELADY, Dennis TRIEU, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Kathryn M. OSEEN-SENDA, Douglas Patrick KELLEY
  • Publication number: 20230337396
    Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.
    Type: Application
    Filed: June 22, 2023
    Publication date: October 19, 2023
    Inventors: Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric Clarence PETERSON
  • Patent number: 11792962
    Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: October 17, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Stephan Wayne Gilges, Eric C. Peterson, Sean Michael James, Christian L. Belady, Marcus Felipe Fontoura, Ioannis Manousakis, Bharath Ramakrishnan
  • Patent number: 11729948
    Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 15, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Bharath Ramakrishnan, Ioannis Manousakis, Nicholas Andrew Keehn, Eric Clarence Peterson
  • Publication number: 20230254997
    Abstract: A computer system with thermal management includes a boiler tank and a first computer component on a substrate in the boiler tank. A cooling fluid is positioned in the boiler tank and covering the first computer component. The boiler tank has a length, width, and height where the length and width of the boiler tank define a tank area that is no more than 50% larger than the substrate area.
    Type: Application
    Filed: June 24, 2021
    Publication date: August 10, 2023
    Inventors: Mark Edward SHAW, Husam Atallah ALISSA, Robert Jason LANKSTON, Brandon Aaron RUBENSTEIN
  • Publication number: 20230232584
    Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.
    Type: Application
    Filed: June 10, 2021
    Publication date: July 20, 2023
    Inventors: Ioannis MANOUSAKIS, Eric Clarence PETERSON, Husam Atallah ALISSA, Nicholas Andrew KEEHN
  • Publication number: 20230232583
    Abstract: A system for thermal management of a computing device includes an immersion chamber, a cooling fluid, a plurality of heat-generating components, and a means for removing vapor from a cooling volume of the cooling fluid. The cooling fluid is positioned in the immersion chamber and fills at least a portion of the immersion chamber. The plurality of heat-generating components is positioned in the cooling fluid and arranged in a series. The series defines the cooling volume of the cooling fluid contacting the plurality of heat-generating components to cool the plurality of heat-generating components.
    Type: Application
    Filed: May 13, 2021
    Publication date: July 20, 2023
    Inventors: Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Husam Atallah ALISSA
  • Publication number: 20230225079
    Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.
    Type: Application
    Filed: March 13, 2023
    Publication date: July 13, 2023
    Inventors: Husam Atallah ALISSA, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric C. PETERSON, Bharath RAMAKRISHNAN, Christian L. BELADY, Ricardo Gouvea BIANCHINI
  • Publication number: 20230217626
    Abstract: Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventors: Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Martha Geoghegan PETERSON, Eric Clarence PETERSON
  • Publication number: 20230201757
    Abstract: A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 29, 2023
    Inventors: Husam Atallah ALISSA, Mark Alan MONROE, Bharath RAMAKRISHNAN, Vaidehi ORUGANTI
  • Publication number: 20230209773
    Abstract: An immersion cooling system includes an immersion tank, a first fluid reservoir, a second fluid reservoir, and a mixing device. The first fluid reservoir contains a first working fluid having a first boiling temperature. The second fluid reservoir contains a second working fluid having a second boiling temperature. The mixing device mixes at least a portion of the first working fluid and at least a portion of the second working fluid into a mixed working fluid, and the mixing device directs the mixed working fluid to the immersion tank.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 29, 2023
    Inventors: Husam Atallah ALISSA, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN
  • Publication number: 20230200026
    Abstract: A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 22, 2023
    Inventors: Husam Atallah ALISSA, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Eric C. PETERSON, Bharath RAMAKRISHNAN, Christian L. BELADY, Ricardo Gouvea BIANCHINI
  • Publication number: 20230156960
    Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 18, 2023
    Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Nicholas Andrew KEEHN, Christian L. BELADY, Ioannis MANOUSAKIS, Dennis TRIEU
  • Publication number: 20230152369
    Abstract: A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 18, 2023
    Inventors: Dennis TRIEU, Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Robert Jason LANKSTON, II, Xudong TANG
  • Patent number: 11653475
    Abstract: An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: May 16, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ioannis Manousakis, Husam Atallah Alissa, Nicholas Andrew Keehn, Bharath Ramakrishnan
  • Patent number: 11606878
    Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: March 14, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Ioannis Manousakis, Nicholas Andrew Keehn, Eric C. Peterson, Bharath Ramakrishnan, Christian L. Belady, Ricardo Gouvea Bianchini
  • Patent number: 11533829
    Abstract: A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: December 20, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Ioannis Manousakis, Nicholas Andrew Keehn, Eric C. Peterson, Bharath Ramakrishnan, Christian L. Belady, Ricardo Gouvea Bianchini