Patents by Inventor Husam Atallah ALISSA

Husam Atallah ALISSA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250120042
    Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 10, 2025
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Christian L. BELADY, Sean Michael JAMES, Vaidehi ORUGANTI
  • Publication number: 20250098115
    Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.
    Type: Application
    Filed: December 4, 2024
    Publication date: March 20, 2025
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Ioannis MANOUSAKIS, Eric Clarence PETERSON, Husam Atallah ALISSA, Nicholas Andrew KEEHN
  • Publication number: 20250096072
    Abstract: The present disclosure relates to thermal management systems in an electronic device. In particular, the systems described herein provide a microfluidic channel between a first die and a second die that acts as an insulating layer between the first die and the second die to prevent heat transfer between the two dies. The systems described herein further provide a first inlet for the first die configured to receive a first working fluid at a first temperature, and a second inlet for the second die configured to receive a second working fluid at a second temperature, therefore providing heterogenous cooling for each die in an integrated chip package.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Inventors: Bharath RAMAKRISHNAN, Vaidehi ORUGANTI, Husam Atallah ALISSA
  • Publication number: 20250062189
    Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.
    Type: Application
    Filed: November 22, 2023
    Publication date: February 20, 2025
    Inventors: Eric C. PETERSON, Husam Atallah ALISSA, Sean Patrick ABBOTT
  • Publication number: 20250063688
    Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.
    Type: Application
    Filed: November 22, 2023
    Publication date: February 20, 2025
    Inventors: Eric C. PETERSON, Husam Atallah ALISSA, Sean Patrick ABBOTT
  • Publication number: 20250063700
    Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.
    Type: Application
    Filed: November 22, 2023
    Publication date: February 20, 2025
    Inventors: Eric C. PETERSON, Husam Atallah ALISSA, Sean Patrick ABBOTT
  • Patent number: 12219734
    Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: February 4, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bharath Ramakrishnan, Husam Atallah Alissa, Christian L. Belady, Sean Michael James, Vaidehi Oruganti
  • Patent number: 12219736
    Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: February 4, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Ioannis Manousakis, Nicholas Andrew Keehn, Eric C. Peterson, Bharath Ramakrishnan, Christian L. Belady, Ricardo Gouvea Bianchini
  • Patent number: 12200907
    Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: January 14, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ioannis Manousakis, Eric Clarence Peterson, Husam Atallah Alissa, Nicholas Andrew Keehn
  • Patent number: 12189441
    Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: January 7, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bharath Ramakrishnan, Husam Atallah Alissa, Eric C. Peterson, Christian L. Belady, Dennis Trieu, Ioannis Manousakis, Nicholas Andrew Keehn, Kathryn M. Oseen-Senda, Douglas Patrick Kelley
  • Publication number: 20240431075
    Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.
    Type: Application
    Filed: September 6, 2024
    Publication date: December 26, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Dennis TRIEU, Ioannis MANOUSAKIS, Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Kathryn M. OSEEN-SENDA, Douglas Patrick KELLEY, Alexis Grace SCHUBERT
  • Publication number: 20240413307
    Abstract: Techniques for increasing an atomic surface area of contact surfaces of an energy source to cause the energy source to increase its energy output are disclosed. An energy source includes first and second contact surfaces, where these contact surfaces are structured to facilitate energy transfer between the energy source and a receiving unit. The contact surfaces each have a first surface area state with a first amount of atomic surface area. A process is applied to the contact surfaces to change the first surface area state to a second surface area state. The second surface area state has a second amount of atomic surface area which is more than the first amount of atomic surface area. The applied process may include applying a current or applying a short to the contact surfaces.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Inventors: Vaidehi ORUGANTI, Husam Atallah ALISSA, Christian L. BELADY
  • Publication number: 20240405879
    Abstract: An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.
    Type: Application
    Filed: January 12, 2024
    Publication date: December 5, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Vaidehi ORUGANTI, Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Christian L. BELADY
  • Publication number: 20240403522
    Abstract: A system may model a thermal management demand of a heat-generating component on an outer surface of the heat-generating component as a heat generation map. A system may select an initial channel design based on the heat generation map. A system may evaluate the initial channel design, wherein evaluated metrics include at least pressure drop and thermal resistance of the channel design. A system may change at least one parameter of the initial channel design based on the evaluated metrics to create a refined channel design. A system may form at least one thermal element in or on the outer surface of the heat-generating component according to the refined channel design.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 5, 2024
    Inventors: Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Vaidehi ORUGANTI, Maria Leena Kyllikki VIITANIEMI, Winston Allen SAUNDERS
  • Publication number: 20240381571
    Abstract: Described are examples for improving heat transfer for a data center, which may include a hermetically sealed container having sides defining an interior portion that is able to hold pressurized gas or air, a data center computer server located within the interior portion, and a spray device located within the interior portion for spraying a non-corrosive fluid over the data center computer server to, in conjunction with the pressurized gas or air, cool at least a portion of the data center computer server.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 14, 2024
    Inventors: Hariharan KUMAR, Husam Atallah ALISSA
  • Publication number: 20240357775
    Abstract: Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Mark Edward SHAW, Husam Atallah Alissa, Brandon Rubenstein, Robert Jason LANKSTON, II, Christian Belady, Bharath Ramakrishnan
  • Publication number: 20240347421
    Abstract: A processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by the first surface of the substrate, and the microfluidic volume is positioned in the second surface of the substrate. The processing unit includes a first electrode positioned in the microfluidic volume and a second electrode positioned in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is positioned in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.
    Type: Application
    Filed: April 11, 2023
    Publication date: October 17, 2024
    Inventors: Vaidehi ORUGANTI, Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Christian L. BELADY
  • Patent number: 12120851
    Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: October 15, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Dennis Trieu, Ioannis Manousakis, Nicholas Andrew Keehn, Husam Atallah Alissa, Bharath Ramakrishnan, Kathryn M. Oseen-Senda, Douglas Patrick Kelley, Alexis Grace Schubert
  • Patent number: 12108568
    Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: October 1, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bharath Ramakrishnan, Husam Atallah Alissa, Eric C. Peterson, Nicholas Andrew Keehn, Christian L. Belady, Ioannis Manousakis, Dennis Trieu
  • Publication number: 20240314977
    Abstract: A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 19, 2024
    Inventors: Nicholas Andrew KEEHN, Husam Atallah ALISSA, Bharath RAMAKRISHNAN, Vaidehi ORUGANTI, Ioannis MANOUSAKIS