Patents by Inventor Husan-Chin Lau

Husan-Chin Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040031689
    Abstract: An electrochemical catalyst electrode to increase bonding durability between covering layers and a metal substrate is made by processing a metal substrate at a high temperature and etching the metal substrate to form a large number of etching pores on granular surfaces; heating the metal substrate to transform the surface thereof to an oxygen interstitial layer; laminating an inner covering layer which is compatible to the oxygen interstitial layer on the metal substrate and deeply planted into the pores to form included angles to increase adhering force between the inner covering layer and the substrate and to reduce peeling on the interface; and forming an outer covering layer on the layers with stabilizing additive added in the outer covering layer to enhance the stability of the outer surface of the covering layers thereby to reduce dissolution of noble metal; and greatly increase stability and durability of the electrode.
    Type: Application
    Filed: August 19, 2002
    Publication date: February 19, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Pau-Yee Lim, Yeushin Yen, Li-Chen Kuo, Jung-Chou Oung, Husan-Chin Lau