Patents by Inventor Huseyin Ekin Sumbul
Huseyin Ekin Sumbul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230401434Abstract: An apparatus is described. The apparatus includes a long short term memory (LSTM) circuit having a multiply accumulate circuit (MAC). The MAC circuit has circuitry to rely on a stored product term rather than explicitly perform a multiplication operation to determine the product term if an accumulation of differences between consecutive, preceding input values has not reached a threshold.Type: ApplicationFiled: August 24, 2023Publication date: December 14, 2023Applicant: Intel CorporationInventors: Ram KRISHNAMURTHY, Gregory K. CHEN, Raghavan KUMAR, Phil KNAG, Huseyin Ekin SUMBUL
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Patent number: 11812599Abstract: Examples herein relate to a memory device comprising an eDRAM memory cell, the eDRAM memory cell can include a write circuit formed at least partially over a storage cell and a read circuit formed at least partially under the storage cell; a compute near memory device bonded to the memory device; a processor; and an interface from the memory device to the processor. In some examples, circuitry is included to provide an output of the memory device to emulate output read rate of an SRAM memory device comprises one or more of: a controller, a multiplexer, or a register. Bonding of a surface of the memory device can be made to a compute near memory device or other circuitry. In some examples, a layer with read circuitry can be bonded to a layer with storage cells. Any layers can be bonded together using techniques described herein.Type: GrantFiled: February 11, 2022Date of Patent: November 7, 2023Assignee: Intel CorporationInventors: Abhishek Sharma, Noriyuki Sato, Sarah Atanasov, Huseyin Ekin Sumbul, Gregory K. Chen, Phil Knag, Ram Krishnamurthy, Hui Jae Yoo, Van H. Le
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Publication number: 20230334006Abstract: A compute near memory (CNM) convolution accelerator enables a convolutional neural network (CNN) to use dedicated acceleration to achieve efficient in-place convolution operations with less impact on memory and energy consumption. A 2D convolution operation is reformulated as 1D row-wise convolution. The 1D row-wise convolution enables the CNM convolution accelerator to process input activations row-by-row, while using the weights one-by-one. Lightweight access circuits provide the ability to stream both weights and input rows as vectors to MAC units, which in turn enables modules of the CNM convolution accelerator to implement convolution for both [1×1] and chosen [n×n] sized filters.Type: ApplicationFiled: June 20, 2023Publication date: October 19, 2023Inventors: Huseyin Ekin SUMBUL, Gregory K. CHEN, Phil KNAG, Raghavan KUMAR, Ram KRISHNAMURTHY
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Patent number: 11790217Abstract: An apparatus is described. The apparatus includes a long short term memory (LSTM) circuit having a multiply accumulate circuit (MAC). The MAC circuit has circuitry to rely on a stored product term rather than explicitly perform a multiplication operation to determine the product term if an accumulation of differences between consecutive, preceding input values has not reached a threshold.Type: GrantFiled: September 25, 2019Date of Patent: October 17, 2023Assignee: Intel CorporationInventors: Ram Krishnamurthy, Gregory K. Chen, Raghavan Kumar, Phil Knag, Huseyin Ekin Sumbul
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Patent number: 11783160Abstract: Various systems, devices, and methods for operating on a data sequence. A system includes a set of circuits that form an input layer to receive a data sequence; first hardware computing units to transform the data sequence, the first hardware computing units connected using a set of randomly selected weights, a first hardware computing unit to: receive an input from a second hardware computing unit, determine a weight of a connection between the first and second hardware computing units using an identifier of the second hardware computing unit and a fixed random weight generator, and operate on the input using the weight to determine a state of the first hardware computing unit; and second hardware computing units to operate on states of the first computing units to generate an output based on the data sequence.Type: GrantFiled: January 30, 2018Date of Patent: October 10, 2023Assignee: Intel CorporationInventors: Phil Knag, Gregory Kengho Chen, Raghavan Kumar, Huseyin Ekin Sumbul, Ram Kumar Krishnamurthy
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Publication number: 20230297819Abstract: An apparatus is described. The apparatus includes a circuit to process a binary neural network. The circuit includes an array of processing cores, wherein, processing cores of the array of processing cores are to process different respective areas of a weight matrix of the binary neural network. The processing cores each include add circuitry to add only those weights of an i layer of the binary neural network that are to be effectively multiplied by a non zero nodal output of an i?1 layer of the binary neural network.Type: ApplicationFiled: May 24, 2023Publication date: September 21, 2023Inventors: Ram KRISHNAMURTHY, Gregory K. CHEN, Raghavan KUMAR, Phil KNAG, Huseyin Ekin SUMBUL, Deepak Vinayak KADETOTAD
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Patent number: 11726950Abstract: A compute near memory (CNM) convolution accelerator enables a convolutional neural network (CNN) to use dedicated acceleration to achieve efficient in-place convolution operations with less impact on memory and energy consumption. A 2D convolution operation is reformulated as 1D row-wise convolution. The 1D row-wise convolution enables the CNM convolution accelerator to process input activations row-by-row, while using the weights one-by-one. Lightweight access circuits provide the ability to stream both weights and input rows as vectors to MAC units, which in turn enables modules of the CNM convolution accelerator to implement convolution for both [1×1] and chosen [n×n] sized filters.Type: GrantFiled: September 28, 2019Date of Patent: August 15, 2023Assignee: Intel CorporationInventors: Huseyin Ekin Sumbul, Gregory K. Chen, Phil Knag, Raghavan Kumar, Ram Krishnamurthy
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Patent number: 11727260Abstract: An apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The memory array includes an embedded dynamic random access memory (eDRAM) memory array. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The mathematical computation circuit includes a switched capacitor circuit. The switched capacitor circuit includes a back-end-of-line (BEOL) capacitor coupled to a thin film transistor within the metal/dielectric layers of the semiconductor chip. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip.Type: GrantFiled: September 24, 2021Date of Patent: August 15, 2023Assignee: Intel CorporationInventors: Abhishek Sharma, Jack T. Kavalieros, Ian A. Young, Ram Krishnamurthy, Sasikanth Manipatruni, Uygar Avci, Gregory K. Chen, Amrita Mathuriya, Raghavan Kumar, Phil Knag, Huseyin Ekin Sumbul, Nazila Haratipour, Van H. Le
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Patent number: 11699681Abstract: An apparatus is formed. The apparatus includes a stack of semiconductor chips. The stack of semiconductor chips includes a logic chip and a memory stack, wherein, the logic chip includes at least one of a GPU and CPU. The apparatus also includes a semiconductor chip substrate. The stack of semiconductor chips are mounted on the semiconductor chip substrate. At least one other logic chip is mounted on the semiconductor chip substrate. The semiconductor chip substrate includes wiring to interconnect the stack of semiconductor chips to the at least one other logic chip.Type: GrantFiled: December 26, 2019Date of Patent: July 11, 2023Assignee: Intel CorporationInventors: Abhishek Sharma, Hui Jae Yoo, Van H. Le, Huseyin Ekin Sumbul, Phil Knag, Gregory K. Chen, Ram Krishnamurthy
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Patent number: 11663452Abstract: An apparatus is described. The apparatus includes a circuit to process a binary neural network. The circuit includes an array of processing cores, wherein, processing cores of the array of processing cores are to process different respective areas of a weight matrix of the binary neural network. The processing cores each include add circuitry to add only those weights of an i layer of the binary neural network that are to be effectively multiplied by a non zero nodal output of an i?1 layer of the binary neural network.Type: GrantFiled: September 25, 2019Date of Patent: May 30, 2023Assignee: Intel CorporationInventors: Ram Krishnamurthy, Gregory K. Chen, Raghavan Kumar, Phil Knag, Huseyin Ekin Sumbul, Deepak Vinayak Kadetotad
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Patent number: 11625584Abstract: Examples described herein relate to a neural network whose weights from a matrix are selected from a set of weights stored in a memory on-chip with a processing engine for generating multiply and carry operations. The number of weights in the set of weights stored in the memory can be less than a number of weights in the matrix thereby reducing an amount of memory used to store weights in a matrix. The weights in the memory can be generated in training using gradients from back propagation. Weights in the memory can be selected using a tabulation hash calculation on entries in a table.Type: GrantFiled: June 17, 2019Date of Patent: April 11, 2023Assignee: Intel CorporationInventors: Raghavan Kumar, Gregory K. Chen, Huseyin Ekin Sumbul, Phil Knag, Ram Krishnamurthy
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Publication number: 20220383081Abstract: A neural network accelerator includes a first memory device, a controller connected to the first memory device through a high-bandwidth (e.g., three-dimensional) interconnect, a configurable processing element (PE) array connected to the first memory device through a first data bus and including a two-dimensional (2D) array of PEs, a local memory connected to the controller and connected, through a second data bus, to the configurable PE array. The controller is configured to, during execution of a neural network (NN), dynamically configure the neural network accelerator for executing each NN layer of a plurality of NN layers of the neural network by selecting either weights of a weight tensor or input data of an input tensor of a tensor operation of the NN layer to store into the local memory, and configuring input and output connections of PEs in the 2D array of PEs for performing the tensor operation.Type: ApplicationFiled: December 16, 2021Publication date: December 1, 2022Inventors: Huichu LIU, Fan WU, Edith DALLARD, Linyan MEI, Huseyin Ekin SUMBUL
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Patent number: 11347477Abstract: A memory circuit includes a number (X) of multiply-accumulate (MAC) circuits that are dynamically configurable. The MAC circuits can either compute an output based on computations of X elements of the input vector with the weight vector, or to compute the output based on computations of a single element of the input vector with the weight vector, with each element having a one bit or multibit length. A first memory can hold the input vector having a width of X elements and a second memory can store the weight vector. The MAC circuits include a MAC array on chip with the first memory.Type: GrantFiled: September 27, 2019Date of Patent: May 31, 2022Assignee: Intel CorporationInventors: Huseyin Ekin Sumbul, Gregory K. Chen, Phil Knag, Raghavan Kumar, Ram Krishnamurthy
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Publication number: 20220165735Abstract: Examples herein relate to a memory device comprising an eDRAM memory cell, the eDRAM memory cell can include a write circuit formed at least partially over a storage cell and a read circuit formed at least partially under the storage cell; a compute near memory device bonded to the memory device; a processor; and an interface from the memory device to the processor. In some examples, circuitry is included to provide an output of the memory device to emulate output read rate of an SRAM memory device comprises one or more of: a controller, a multiplexer, or a register. Bonding of a surface of the memory device can be made to a compute near memory device or other circuitry. In some examples, a layer with read circuitry can be bonded to a layer with storage cells. Any layers can be bonded together using techniques described herein.Type: ApplicationFiled: February 11, 2022Publication date: May 26, 2022Inventors: Abhishek SHARMA, Noriyuki SATO, Sarah ATANASOV, Huseyin Ekin SUMBUL, Gregory K. CHEN, Phil KNAG, Ram KRISHNAMURTHY, Hui Jae YOO, Van H. LE
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Patent number: 11281963Abstract: An integrated circuit (IC), as a computation block of a neuromorphic system, includes a time step controller to activate a time step update signal for performing a time-multiplexed selection of a group of neuromorphic states to update. The IC includes a first circuitry to, responsive to detecting the time step update signal for a selected group of neuromorphic states: generate an outgoing data signal in response to determining that a first membrane potential of the selected group of neuromorphic states exceeds a threshold value, wherein the outgoing data signal includes an identifier that identifies the selected group of neuromorphic states and a memory address (wherein the memory address corresponds to a location in a memory block associated with the integrated circuit), and update a state of the selected group of neuromorphic states in response to generation of the outgoing data signal.Type: GrantFiled: September 26, 2016Date of Patent: March 22, 2022Assignee: Intel CorporationInventors: Raghavan Kumar, Gregory K. Chen, Huseyin Ekin Sumbul, Phil Knag
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Patent number: 11251186Abstract: Examples herein relate to a memory device comprising an eDRAM memory cell, the eDRAM memory cell can include a write circuit formed at least partially over a storage cell and a read circuit formed at least partially under the storage cell; a compute near memory device bonded to the memory device; a processor; and an interface from the memory device to the processor. In some examples, circuitry is included to provide an output of the memory device to emulate output read rate of an SRAM memory device comprises one or more of: a controller, a multiplexer, or a register. Bonding of a surface of the memory device can be made to a compute near memory device or other circuitry. In some examples, a layer with read circuitry can be bonded to a layer with storage cells. Any layers can be bonded together using techniques described herein.Type: GrantFiled: March 23, 2020Date of Patent: February 15, 2022Assignee: Intel CorporationInventors: Abhishek Sharma, Noriyuki Sato, Sarah Atanasov, Huseyin Ekin Sumbul, Gregory K. Chen, Phil Knag, Ram Krishnamurthy, Hui Jae Yoo, Van H. Le
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Publication number: 20220012581Abstract: An apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The memory array includes an embedded dynamic random access memory (eDRAM) memory array. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The mathematical computation circuit includes a switched capacitor circuit. The switched capacitor circuit includes a back-end-of-line (BEOL) capacitor coupled to a thin film transistor within the metal/dielectric layers of the semiconductor chip. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Inventors: Abhishek SHARMA, Jack T. KAVALIEROS, Ian A. YOUNG, Ram KRISHNAMURTHY, Sasikanth MANIPATRUNI, Uygar AVCI, Gregory K. CHEN, Amrita MATHURIYA, Raghavan KUMAR, Phil KNAG, Huseyin Ekin SUMBUL, Nazila HARATIPOUR, Van H. LE
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Patent number: 11138499Abstract: An apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The memory array includes an embedded dynamic random access memory (eDRAM) memory array. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The mathematical computation circuit includes a switched capacitor circuit. The switched capacitor circuit includes a back-end-of-line (BEOL) capacitor coupled to a thin film transistor within the metal/dielectric layers of the semiconductor chip. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip.Type: GrantFiled: September 28, 2018Date of Patent: October 5, 2021Assignee: Intel CorporationInventors: Abhishek Sharma, Jack T. Kavalieros, Ian A. Young, Sasikanth Manipatruni, Ram Krishnamurthy, Uygar Avci, Gregory K. Chen, Amrita Mathuriya, Raghavan Kumar, Phil Knag, Huseyin Ekin Sumbul, Nazila Haratipour, Van H. Le
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Patent number: 11062203Abstract: In one embodiment, a method comprises receiving a selection of a neural network topology type; identifying a synapse memory mapping scheme for the selected neural network topology type from a plurality of synapse memory mapping schemes that are each associated with a respective neural network topology type; and mapping a plurality of synapse weights to locations in a memory based on the identified synapse memory mapping scheme.Type: GrantFiled: December 30, 2016Date of Patent: July 13, 2021Assignee: Intel CorporationInventors: Gregory K. Chen, Raghavan Kumar, Huseyin Ekin Sumbul, Phil Knag, Ram K. Krishnamurthy
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Patent number: 11061646Abstract: Compute-in memory circuits and techniques are described. In one example, a memory device includes an array of memory cells, the array including multiple sub-arrays. Each of the sub-arrays receives a different voltage. The memory device also includes capacitors coupled with conductive access lines of each of the multiple sub-arrays and circuitry coupled with the capacitors, to share charge between the capacitors in response to a signal. In one example, computing device, such as a machine learning accelerator, includes a first memory array and a second memory array. The computing device also includes an analog processor circuit coupled with the first and second memory arrays to receive first analog input voltages from the first memory array and second analog input voltages from the second memory array and perform one or more operations on the first and second analog input voltages, and output an analog output voltage.Type: GrantFiled: September 28, 2018Date of Patent: July 13, 2021Assignee: Intel CorporationInventors: Huseyin Ekin Sumbul, Phil Knag, Gregory K. Chen, Raghavan Kumar, Abhishek Sharma, Sasikanth Manipatruni, Amrita Mathuriya, Ram Krishnamurthy, Ian A. Young