Patents by Inventor Husnu Masaracioglu

Husnu Masaracioglu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit package with internal and external shielding
    Patent number: 10141268
    Abstract: A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: November 27, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Domingo Figueredo, Husnu Masaracioglu, Marshall Maple, Deog-Soon Choi, Ashish Alawani
  • CIRCUIT PACKAGE WITH INTERNAL AND EXTERNAL SHIELDING
    Publication number: 20170127581
    Abstract: A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 4, 2017
    Inventors: Domingo Figueredo, Husnu Masaracioglu, Marshall Maple, Deog-Soon Choi, Ashish Alawani