Patents by Inventor Huu Dang
Huu Dang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9964297Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: GrantFiled: January 7, 2016Date of Patent: May 8, 2018Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Patent number: 9927852Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.Type: GrantFiled: August 25, 2015Date of Patent: March 27, 2018Assignee: Cisco Technology, Inc.Inventors: Vic Chia, Long Huu Dang, Hong Huynh
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Publication number: 20170081841Abstract: This invention relates to a system of ventilating a residential or light commercial structure with lightweight, easy to install radiant barriers that reflect external sunlight heat away from the structure, reflect heat produced within the structure to maintain internal warmth, and contain internal air ventilation space to prevent condensation.Type: ApplicationFiled: July 6, 2016Publication date: March 23, 2017Inventor: Huu Dang Le
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Publication number: 20170060197Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.Type: ApplicationFiled: August 25, 2015Publication date: March 2, 2017Inventors: Vic CHIA, Long Huu Dang, Hong Huynh
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Publication number: 20160116149Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Patent number: 9255703Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: GrantFiled: June 13, 2014Date of Patent: February 9, 2016Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Publication number: 20150362167Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.Type: ApplicationFiled: June 13, 2014Publication date: December 17, 2015Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
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Publication number: 20140378381Abstract: The present invention provides an oil-in-water nanoemulsion containing glucagon, an oily phase, and an aqueous phase, wherein the glucagon is physically and chemically stable and the nanoemulsion is suitable for administration by manual injection or by a pump to treat hypoglycemia.Type: ApplicationFiled: June 25, 2014Publication date: December 25, 2014Inventors: Andrew Xian Chen, Norman Keith Orida, Hailiang Chen, Hau Huu Dang
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Patent number: 7113406Abstract: A circuit board module has a circuit board which includes a circuit board structure and a set of components mounted to the circuit board structure. The circuit board module further includes a set of heatsinks (i.e., one or more heatsinks) and a heatsink retaining assembly fastened to the circuit board. The heatsink retaining assembly includes (i) a set of brackets, each bracket being elongated in shape and having a first end and a second end, (ii) a frame, and (iii) a fastening mechanism configured to fasten the frame to a circuit board. The frame is configured to simultaneously hold the first and second ends of each bracket relative to the circuit board to enable that bracket to assert holding force on the set of heatsinks.Type: GrantFiled: July 22, 2004Date of Patent: September 26, 2006Assignee: Cisco Technology, Inc.Inventors: Nguyen Tu Nguyen, Long Huu Dang, Saeed Seyed
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Patent number: 7020376Abstract: A tool device for selectively extracting, installing, and removing a plurality of optical connectors is disclosed. The tool device has a prying end coupled to a grasping end. The prying and the grasping end are intercoupled by a pair of arms, which is disposed to transmit a grasping force to the grasping end. With respect to the various types of optical connectors and their receptacles that it can be used to extract, install, or remove, the tool device is versatile. The tool can be used on optical connectors of types including ‘MTP’, ‘MPO’, ‘MT-RJ’, ‘MU’, ‘LC’, ‘SC’, and on SFP optical connector receptacles.Type: GrantFiled: January 31, 2003Date of Patent: March 28, 2006Assignee: Cisco Technology, Inc.Inventors: Long Huu Dang, Nguyen Tu Nguyen, Saeed Seyed
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Patent number: 6809258Abstract: An apparatus for managing the routing of a cable intercoupling two components in an installation is disclosed. The apparatus has a drawer for storing a portion of the cable and a drawer for cross-connecting the cable, which is connected to one component, with another cable, which is connected to the other component. The apparatus can be used with optical and electrical cables.Type: GrantFiled: February 24, 2003Date of Patent: October 26, 2004Assignee: Cisco Technology, Inc.Inventors: Long Huu Dang, Nguyen Tu Nguyen, Saeed Seyed