Abstract: Implementations of the present disclosure involve methods and systems for component placement in a datapath block of a microelectronic circuit design. In particular, implementations provide for collecting groups of common components in the datapath block that form a row or partial row. A preliminary layout of the datapath block is performed with the component set rows and any other components of the datapath block design. Common components are then collected into groups or sets to form additional rows within the datapath layout, with at least some consideration to the wire lengths between components in the rows. By collecting common components into rows with consideration to the wire lengths between interconnected components, the timing performance of the datapath block may be improved.

Abstract: Implementations of the present disclosure involve methods and systems for component placement in a datapath block of a microelectronic circuit design. In particular, implementations provide for collecting groups of common components in the datapath block that form a row or partial row. A preliminary layout of the datapath block is performed with the component set rows and any other components of the datapath block design. Common components are then collected into groups or sets to form additional rows within the datapath layout, with at least some consideration to the wire lengths between components in the rows. By collecting common components into rows with consideration to the wire lengths between interconnected components, the timing performance of the datapath block may be improved.