Patents by Inventor Huyen T. Tran

Huyen T. Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230058302
    Abstract: The present disclosure describes products formulated to inhibit respiratory conditions and symptoms in animals, along with associated methods of providing such products to the animals. Feeding methods involve providing animals with a feed product that includes a direct-fed microbial composition, at least one phytogenic compound, and/or at least one vitamin. The direct-fed microbial composition includes one or more strains of Bacillus. The animals can include swine or cattle at risk of developing, or already afflicted with, a respiratory condition. Inhibition of respiratory stress can reduce mortality rates and medication administration relative to animals fed the same diet but lacking the feed product.
    Type: Application
    Filed: August 3, 2021
    Publication date: February 23, 2023
    Inventors: Huyen T. Tran, Brenda de Rodas, Theodore P. Karnezos, Diana Ayala
  • Patent number: 6638810
    Abstract: The invention provides a method for forming a metal nitride film by depositing a metal oxide film on the substrate and exposing the metal oxide film to a nitrating gas to densify the metal oxide and form a metal nitride film. The metal oxide film is deposited by the decomposition of a chemical vapor deposition precursor. The nitrating step comprises exposing the metal oxide film to a thermally or plasma enhanced nitrating gas preferably comprising nitrogen, oxygen, and ammonia. The invention also provides a process for forming a liner/barrier scheme for a metallization stack by forming a metal nitride layer over the substrate by the densification of a metal oxide layer by a nitrating gas depositing a metal liner layer. Optionally, a metal liner layer may be deposited over substrate prior to the metal nitride layer to forma metal/metal nitride liner/barrier scheme.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: October 28, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Mouloud Bakli, Steve G. Ghanayem, Huyen T. Tran
  • Publication number: 20030008501
    Abstract: The invention provides a method for forming a metal nitride film by depositing a metal oxide film on the substrate and exposing the metal oxide film to a nitrating gas to densify the metal oxide and form a metal nitride film. The metal oxide film is deposited by the decomposition of a chemical vapor deposition precursor. The nitrating step comprises exposing the metal oxide film to a thermally or plasma enhanced nitrating gas preferably comprising nitrogen, oxygen, and ammonia. The invention also provides a process for forming a liner/barrier scheme for a metallization stack by forming a metal nitride layer over the substrate by the densification of a metal oxide layer by a nitrating gas depositing a metal liner layer. Optionally, a metal liner layer may be deposited over substrate prior to the metal nitride layer to forma metal/metal nitride liner/barrier scheme.
    Type: Application
    Filed: November 5, 2001
    Publication date: January 9, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Mouloud Bakli, Steve G. Ghanayem, Huyen T. Tran
  • Patent number: 6319766
    Abstract: The invention provides a method for forming a metal nitride film by depositing a metal oxide film on the substrate and exposing the metal oxide film to a nitrating gas to densify the metal oxide and form a metal nitride film. The metal oxide film is deposited by the decomposition of a chemical vapor deposition precursor. The nitrating step comprises exposing the metal oxide film to a thermally or plasma enhanced nitrating gas preferably comprising nitrogen, oxygen, and anunonia. The invention also provides a process for forming a liner/barrier scheme for a metallization stack by forming a metal nitride layer over the substrate by the densification of a metal oxide layer by a nitrating gas depositing a metal liner layer. Optionally, a metal liner layer may be deposited over substrate prior to the metal nitride layer to form a metal/metal nitride liner/barrier scheme.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: November 20, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Mouloud Bakli, Steve G. Ghanayem, Huyen T. Tran
  • Patent number: 6204203
    Abstract: A method of forming a metal oxide dielectric film. According to the present invention an amorphous metal oxide dielectric film is deposited over a substrate utilizing a metal organic precursor. The substrate is then heated in an inert ambient to convert the amorphous metal oxide dielectric to a polycrystalline metal oxide dielectric. The polycrystalline metal dielectric is then heated in a oxygen containing ambients.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: March 20, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Pravin K. Narwankar, Turgut Sahin, Gregory F. Redinbo, Patricia M. Liu, Huyen T. Tran