Patents by Inventor Hwa In YOON

Hwa In YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166110
    Abstract: A leg rest apparatus includes a base bracket mounted below a seat cushion of a vehicle seat, a rear link coupled to a lateral portion of the base bracket, a front link coupled to the lateral portion of the base bracket and positioned above the rear link, a main link hingedly coupled to one end of the rear link and a middle portion of the front link, a support link coupled to one end of the front link, and a leg rest link coupled to the main link and one end of the support link.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 23, 2024
    Inventors: JONG SU KIM, KYEONG JU KIM, HWA YOUNG MUN, GWON HWA BOK, Cheolhwan YOON, JAE YONG JANG, HAN YUN CHOI, Junsik HWANG
  • Publication number: 20240150771
    Abstract: Therapeutic compounds for red blood cell-mediated delivery of an active pharmaceutical ingredient to a target cell are described. The therapeutic compounds are configured to bind CD47 on the surface of a red blood cell and to be subsequently transferred to CD47 on the surface of the target cell, the therapeutic compound ultimately being internalized by the target cell via endocytosis. The target cell may be a fibrotic cell.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 9, 2024
    Inventors: HoWon J. Kim, In-San Kim, Jay S. Kim, Sun Hwa Kim, Ick Chan Kwon, Jong Won Lee, Yoo Soo Yang, Hong Yeol Yoon
  • Patent number: 11938247
    Abstract: Provided are a method for fabricating a human nasal turbinate-derived mesenchymal stem cell-based 3D bioprinted construct, and a use thereof, wherein the human nasal turbinate-derived mesenchymal stem cell-based, 3D bioprinted construct is advantageous over conventional mesenchymal stem cell-based, 3D bioprinted constructs in that the former can survive and proliferate stably in vitro and/or in vivo and shows high osteogenic differentiation ability as well, therefore is expected to make a great contribution to the practical use of cellular therapeutic agents.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: March 26, 2024
    Assignee: CATHOLIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Sung Won Kim, Jung Yeon Lim, Sun Hwa Park, Byeong Gon Yoon, Dong-Woo Cho, Jinah Jang, Seok Won Kim
  • Patent number: 11929451
    Abstract: A semiconductor light emitting device includes a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a transparent electrode layer on the second conductivity-type semiconductor layer and spaced apart from an edge of the second conductivity-type semiconductor layer, a first insulating layer on the light emitting structure to cover the transparent electrode layer and including a plurality of holes connected to the transparent electrode layer, and a reflective electrode layer on the first insulating layer and connected to the transparent electrode layer through the plurality of holes.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JuHeon Yoon, Jung Hwan Kil, Tae Hun Kim, Hwa Ryong Song, Jae In Sim
  • Publication number: 20230238753
    Abstract: The present invention relates to a board connection assembly being characterized by comprising: a board connection pin for transmitting a signal; a dielectric portion having a first insertion hole into which the board connection pin is inserted; a housing having a trench into which a part of the dielectric portion is inserted and a second insertion hole into which the board connection pin is inserted; and a ground contact portion disposed between the housing and the dielectric portion to contact a ground electrode, wherein the ground contact portion has one side inserted into the trench so as to contact one surface of the trench, and the other side formed to be grounded with the ground electrode, and the height of the housing is configured to be smaller than the width of the housing.
    Type: Application
    Filed: December 20, 2021
    Publication date: July 27, 2023
    Inventors: Sun Hwa CHA, Young Jo KIM, Hwa Yoon SONG, Kyung Hun JUNG, Hee Seok JUNG
  • Patent number: 11682870
    Abstract: The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 20, 2023
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20230172908
    Abstract: The present inventive concept relates to a pharmaceutical composition for prevention or treatment of fibrosis or a health functional food composition for prevention or alleviation of fibrosis, each composition containing a 1H-pyrazole-3-amide-based compound or a pharmaceutically acceptable salt thereof as an active ingredient. The compound exhibits a fibrosis mitigation effect in fibrosis-induced mouse models, and thus the compositions containing the compound as an active ingredient can be favorably utilized for prevention or treatment of fibrosis.
    Type: Application
    Filed: September 12, 2018
    Publication date: June 8, 2023
    Inventors: Wook KIM, Sung-Hwa YOON, Ji Hye HAN, Han Ho SHIN, Ju-Young PARK
  • Patent number: 11622445
    Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 4, 2023
    Assignee: ILJIN MATERIALS CO., LTD.
    Inventors: Sang Hwa Yoon, Chang Yol Yang, Jung Woo Seo, Young Ho Ryu, Kideok Song, Eun Sil Choi, Won Jin Beom, Hyung Cheol Kim
  • Publication number: 20230100478
    Abstract: The present invention relates to a fixed connector including a body fixedly inserted into a substrate, a signal pin having one side inserted into the body and the other side extending from the one side to be disposed on the substrate, and a dielectric coupling the signal pin and the body, wherein a portion of the signal pin has an L shape to be in contact with the substrate, and the portion of the signal pin is exposed to an outside of the body.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 30, 2023
    Inventors: Kyung-hun JUNG, Hwa-yoon SONG, Hee-seok JUNG
  • Publication number: 20220399547
    Abstract: Disclosed herein are a surface-treated copper foil for a negative electrode current collector for secondary batteries, a method for producing the same, and a negative electrode for secondary batteries including the same. The surface-treated copper foil includes needle-shaped copper particles formed on at least one surface thereof, wherein the copper particles have an average major-axis length of about 0.6 ?m to about 2.0 ?m and are separated from one another by a distance of about 1 ?m to about 5 ?m.
    Type: Application
    Filed: December 20, 2019
    Publication date: December 15, 2022
    Inventors: Sang Hwa YOON, Jung Woo SEO, Eun Sil CHOI, Young Ho RYU, Hyung Cheol KIM, Won Jin BEOM, Ki Deok SONG, Chang Yol YANG
  • Publication number: 20220367114
    Abstract: Provided is an electrolytic nickel foil including, on at least one surface thereof, a flat surface having the following surface roughness: a Ra of 0.05 ?m or less, a Rz of 0.2 ?m or less, and a Rt of 0.5 ?m or less and a glossiness of 200 GU or more as determined by measuring a 60° specular reflection angle.
    Type: Application
    Filed: December 17, 2019
    Publication date: November 17, 2022
    Inventors: Ki Deok SONG, Chang Yol YANG, Sang Hwa YOON
  • Patent number: 11411360
    Abstract: The present invention relates to a connection having a joint with a limited range of motion, the connector including: a connection connector including a connection signal pin, a connection dielectric surrounding the connection signal pin, and a connection ground electrically insulated from the connection signal pin by the connection dielectric; and a first fixed connector into which one side of the connection connector is inserted and which allows a joint of the connection connector to move on the basis of the inserted one side of the connection connector, wherein the connection ground includes a connection protruding portion formed so that one end of the connection ground protrudes outward, a connection limiting portion which is adjacent to the connection protruding portion, has a thickness smaller than a thickness of the connection protruding portion, and comes in contact with an inner side of the first fixed connector to limit a range of motion of the joint of the connection connector, a connection elastic
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 9, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Sun Hwa Cha, Hwa Yoon Song, Chang Hyun Yang, Jae Jun Lee, Sang Min Seo, Hee seok Jung
  • Publication number: 20220200174
    Abstract: The present invention provides a connector and a board connecting assembly. The connector according to the present invention includes a connection pin partially inserted into a board to transmit a high-frequency signal, and a dielectric body having a first opening into which the connection pin is inserted, wherein the connection pin includes a central portion, which is disposed in the first opening of the dielectric body, and a first connection portion extending upward from the central portion and protruding upward from the dielectric body, and a diameter of the central portion is greater than that of the first connection portion.
    Type: Application
    Filed: November 10, 2021
    Publication date: June 23, 2022
    Inventors: Sun-hwa Cha, Young-jo Kim, Hwa-yoon Song, Kyung-hun Jung, Hee-seok Jung
  • Patent number: 11355874
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: June 7, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Young Jo Kim, Yu Jin Lee, Jae Jun Lee, Sang Min Seo, Hee seok Jung
  • Patent number: 11349235
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 31, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Young Jo Kim, Yu Jin Lee, Jae Jun Lee, Sang Min Seo, Hee Seok Jung
  • Publication number: 20220013966
    Abstract: The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.
    Type: Application
    Filed: October 16, 2019
    Publication date: January 13, 2022
    Inventors: Hwa Yoon SONG, Sang Min SEO, Eun Jung KIM, Jin Uk LEE, Kyung Hun JUNG, Hee seok JUNG
  • Patent number: 11183785
    Abstract: A board mating connector includes a signal contact unit, a first ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit, a second ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit and at least a portion of the first ground portion, and an elastic member disposed between the first ground portion and the second ground portion to provide an elastic restoring force in a first direction. The first ground portion includes a first protrusion protruding outward or inward from a lower end portion thereof, and the second ground portion includes a second protrusion protruding from an upper end portion thereof in a direction different from that of the first protrusion. The first protrusion is engaged with the second protrusion in the hollow portion of the second ground portion.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: November 23, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Sun Hwa Cha, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung
  • Patent number: D926695
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 3, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D945378
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 8, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Young Jo Kim, Yu Jin Lee, Jae Jun Lee, Sang Min Seo, Hee seok Jung
  • Patent number: D978801
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: February 21, 2023
    Assignee: GIGALANE CO., LTD.
    Inventors: Sun Hwa Cha, Young Jo Kim, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung