Abstract: The present invention relates to an LED cooling device and, more specifically, to an LED cooling device for increasing cooling efficiency by smoothly circulating air in an LED module, comprising a structure having: an LED lamp in which LEDs for emitting light are provided on one lateral surface of a substrate and a heat exchange means for absorbing and radiating heat is provided on the other lateral surface of the substrate; a pumping member in which a supply hole for supplying air is formed at a lower end on the outer circumference of one side on one lateral surface of the heat exchange means of the LED lamp and an inflow hole for introducing the air is formed at a central part of an upper end thereof, wherein a check valve for controlling the inflow of air is provided at the inflow hole; an operating lobe which has a predetermined length and is provided at a central part of a lower end of the pumping member; and a transfer unit for upwardly and downwardly moving the operating lobe to expand or contract the

Abstract: A bulb-type LED lighting apparatus, including: a base unit; a heat dissipating space retaining unit; a cooling block connected to the heat dissipating space retaining unit and having heat pipe fitting holes and heat dissipating fins; first and second LED circuit boards having LED modules; a heat dissipating frame including heat exchanging plates, clip parts formed on cooling fins of the heat exchanging plates so as to hold heat pipes, cover locking slits for locking protective covers, and a circuit board seat for seating the first LED circuit board; a connection plate unit including pipe fitting slots, cover locking slits for fitting the protective covers, and shoulders for supporting the protective covers; and convective circulation passages defined between the heat exchanging plates so as to allow air to circulate between the heat exchanging plates and realize circulation of air between the inside and outside of the heat dissipating frame therethrough.

Abstract: A bulb-type LED lighting apparatus, including: a base unit; a heat dissipating space retaining unit; a cooling block connected to the heat dissipating space retaining unit and having heat pipe fitting holes and heat dissipating fins; first and second LED circuit boards having LED modules; a heat dissipating frame including heat exchanging plates, clip parts formed on cooling fins of the heat exchanging plates so as to hold heat pipes, cover locking slits for locking protective covers, and a circuit board seat for seating the first LED circuit board; a connection plate unit including pipe fitting slots, cover locking slits for fitting the protective covers, and shoulders for supporting the protective covers; and convective circulation passages defined between the heat exchanging plates so as to allow air to circulate between the heat exchanging plates and realize circulation of air between the inside and outside of the heat dissipating frame therethrough.

Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.