Patents by Inventor Hwa Jin JANG

Hwa Jin JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating semiconductor device
    Patent number: 10153170
    Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first fin structure which includes first semiconductor patterns and second semiconductor patterns stacked alternately on a substrate and extends in a first direction, forming an exposed first wire pattern group which includes the second semiconductor patterns by removing the first semiconductor patterns, heat-treating the exposed first wire pattern group, and forming a first gate electrode which surrounds the first wire pattern group and extends in a second direction different from the first direction.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: December 11, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwa Jin Jang, Jae Young Park, Sun Young Lee, Ha Kyu Seong, Han Mei Choi
  • METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    Publication number: 20170358457
    Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first fin structure which includes first semiconductor patterns and second semiconductor patterns stacked alternately on a substrate and extends in a first direction, forming an exposed first wire pattern group which includes the second semiconductor patterns by removing the first semiconductor patterns, heat-treating the exposed first wire pattern group, and forming a first gate electrode which surrounds the first wire pattern group and extends in a second direction different from the first direction.
    Type: Application
    Filed: January 26, 2017
    Publication date: December 14, 2017
    Inventors: Hwa Jin JANG, Jae Young PARK, Sun Young LEE, Ha Kyu SEONG, Han Mei CHOI