Patents by Inventor Hwa Seob Lee

Hwa Seob Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die bonding apparatus having multiple bonding head units
    Patent number: 7896051
    Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 1, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventors: Byung Chul Kang, Kwang Duck Koh, Jum Dong Lee, Hwa Seob Lee, Jae Moo Shin
  • SEMICONDUCTOR DIE BONDING APPARATUS HAVING MULTIPLE BONDING HEAD UNITS
    Publication number: 20090120589
    Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.
    Type: Application
    Filed: December 12, 2007
    Publication date: May 14, 2009
    Inventors: Byung Chul Kang, Kwang Duck Koh, Jum Dong Lee, Hwa Seob Lee, Jae Moo Shin