Abstract: Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers.

Abstract: Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes.

Abstract: Provided is a polymer resin composition for manufacturing an insulating film for manufacture of a printed circuit board. The polymer resin composition includes polymer resins and graphene for linking the polymer resins with larger attraction than Van Deer Waals's force of the polymer resins.

Abstract: Disclosed herein is a radiating substrate radiating heat generated from a predetermined heating element to the outside. The radiating substrate includes polymer resins and graphenes distributed in the polymer resins.

Abstract: Disclosed are a recovery for a metaloxidic cathodic active material for a lithium ion secondary battery and a synthesis thereof by the recovery method, wherein the recovery method includes (a) dissolving a cathodic active material from a waste lithium ion secondary battery using sulfuric acid solution containing sulfurous acid gas to generate a solution containing metal ions, (b) injecting sodium hydroxide solution and ammonia solution in the solution containing the metal ions to fabricate an electrode active material precursor, and (c) filtrating the active material precursor, followed by drying and grinding, thus to fabricate a solid-state cathodic active material precursor, and the synthesis method is achieved by mixing the electrode active material precursor fabricated according to the recovery method with lithium carbonate or lithium hydroxide, followed by heat treatment, to generate a metaloxidic cathodic active material.

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed herein is a method for preparation of a mesoporous polymer nano-composite material, more particularly, a method for preparation of a meso-porous polymer nano-polymerized composite material which includes: drying a solid material having pores under vacuum at ambient temperature and pressure; adding a first organic solvent to the vacuum dried solid material in the reactor and dispersing the first organic solvent in pores of the solid material by an ultrasonicator to remove air while wetting a surface of the solid material with acetonitrile; adding a constant amount of a material having radicals or functional groups relative to weight of the mixture containing the solid material and the first organic solvent in a reactor, which was prepared in the above step, and agitating the mixture; introducing a polymerization initiator into the reactor containing the mixture prepared in the above step, in order to initiate polymerization of the mixture in the reactor; using a second organic solvent to filter and w

Abstract: Disclosed is a method of preparing a positive active material for a lithium battery. The method comprises: depositing a positive active material on an electrode on a substrate (1); and putting metal chips on a metal oxides target and performing a sputtering process, thereby depositing mixed metal-oxides on the positive active material (2). In another aspect, the method comprises: preparing an electrode active material; preparing a precursor solution including the electrode active material; and printing the precursor solution on the substrate, and evaporating a solvent at a temperature of 80-120° C.

Abstract: Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers.

Abstract: Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

Abstract: Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.

Abstract: It relates to a norbornene-based polymer having low dielectric constant which is thus suitable for a low loss dielectric material, an insulating material using the same, an embedded printed circuit board and a functional device, in which the norbornene-based polymer includes at least one repeat unit of formula 1: wherein, at least one of R1 to R4 may be independently selected from the group consisting of hydrogen, in which R5, R6 and R7 are each independently selected from the group consisting of hydrogen, substituted or unsubstituted C1-C6 alkyl, C1-C6 alkyl substituted with an aliphatic bicyclo or multicyclo compound, substituted or unsubstituted C2-C6 alkenyl and substituted or unsubstituted C4-C31 arylalkyl, L is C1-C3 alkyl.

Abstract: The present invention relates to a to a norbornene-based polymer having a low dielectric constant and low-loss properties, and an insulating material, a printed circuit board and a functional device using the same. More particularly, it relates to a norbornene-based polymer expressed by the following formula (1): wherein, at least one of R1 to R4 is independently substituted or unsubstituted linear C4-C31 arylalkyl or substituted or unsubstituted branched C4-C31 arylalkyl; the rest of R1 to R4 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 250 to 400.

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.

Abstract: Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group.

Abstract: The present invention relates a eucryptite ceramic filler and an insulating composite material containing the eucryptite ceramic filler. In particular, the invention provides a eucryptite ceramic filler of formula (I): xLiO2-yAl2O3-zSiO2 ??(I) wherein x, y and z represent a molar ratio, x and y are each independently from 0.9 to 1.1, and z is from 1.9 to 2.1; and the eucryptite ceramic filler is used to reduce a coefficient of thermal expansion of an insulating composite material.

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.