Patents by Inventor Hwa-Eon Shin

Hwa-Eon Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120142177
    Abstract: A method of manufacturing a wiring structure and a semiconductor device, the method of manufacturing a wiring structure including forming a first insulating interlayer on a substrate; forming a contact plug in an opening in the first insulating interlayer; forming a second insulating interlayer on the contact plug and the first insulating interlayer; removing a portion of the second insulating interlayer to form an opening therethrough such that the opening exposes the contact plug; filling a portion of the opening to form a wiring such that the wiring is electrically connected to the contact plug; and forming a diffusion barrier layer pattern on the wiring such that the diffusion barrier layer pattern fills a remaining portion of the opening.
    Type: Application
    Filed: November 18, 2011
    Publication date: June 7, 2012
    Inventors: Jee-Yong Kim, Joon-Hee Lee, Jeong-Hyuk Choi, Jai-Hyuk Song, Seung-Wan Hong, Hwa-Eon Shin, Jong-Hyun Park, Woo-Jung Kim, Jae-Sung Ahn, Jung-Hwan Lee