Patents by Inventor Hwai-Hai Chiang

Hwai-Hai Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10990131
    Abstract: A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: April 27, 2021
    Assignee: TPK Touch Solutions (Xiamen) Inc.
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Patent number: 10698516
    Abstract: A flexible touch-sensing component is formed on a release film by support provided from a first carrier substrate and a second carrier substrate. Then, the flexible touch-sensing component can be attached onto non-planar and curved cover plates through the reloading of a third carrier substrate, so that the touch panel can be lighter and thinner, and have a lower processing cost. In addition, the flexible touch-sensing component uses a film sensor that includes a metal nanowire conductive layer. Since the silver nanowire has flexibility, the touch sensor and the touch panel in the present disclosure can be used in flexible touch-sensing devices and curved-surface touch-sensing devices. Furthermore, based on application of an adhesive reactive ink, the released touch panel can be directly attached to target carrier substrate without adding an auxiliary layer of optical glue or hydrogel glue.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 30, 2020
    Assignee: TPK Touch Solutions (Xiamen) Inc.
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Publication number: 20190196633
    Abstract: A flexible touch-sensing component is formed on a release film by support provided from a first carrier substrate and a second carrier substrate. Then, the flexible touch-sensing component can be attached onto non-planar and curved cover plates through the reloading of a third carrier substrate, so that the touch panel can be lighter and thinner, and have a lower processing cost. In addition, the flexible touch-sensing component uses a film sensor that includes a metal nanowire conductive layer. Since the silver nanowire has flexibility, the touch sensor and the touch panel in the present disclosure can be used in flexible touch-sensing devices and curved-surface touch-sensing devices. Furthermore, based on application of an adhesive reactive ink, the released touch panel can be directly attached to target carrier substrate without adding an auxiliary layer of optical glue or hydrogel glue.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Publication number: 20190196549
    Abstract: A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 27, 2019
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang