Abstract: An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.

Abstract: An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.