Patents by Inventor HWAN JOO PARK

HWAN JOO PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240047290
    Abstract: A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in the second area, and a thermal diffusion structure is on a top face of the interposer in the first area. The thermal diffusion structure is configured so that heat generated in the first die is discharged through the thermal diffusion structure.
    Type: Application
    Filed: March 15, 2023
    Publication date: February 8, 2024
    Inventors: Sung Gu KANG, Jae Choon KIM, Hwan Joo PARK, Sung-Ho MUN
  • Thermoelectric device and thermoelectric module
    Patent number: 11139421
    Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: October 5, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Sam Yoo, Woo Chul Kim, Hyung Eui Lee, Jong Hyun Kim, Hwan Joo Park, Yoo Min Eom, Jun Phil Hwang
  • THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE
    Publication number: 20190198741
    Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.
    Type: Application
    Filed: August 28, 2017
    Publication date: June 27, 2019
    Inventors: YOUNG SAM YOO, WOO CHUL KIM, HYUNG EUI LEE, JONG HYUN KIM, HWAN JOO PARK, YOO MIN EOM, JUN PHIL HWANG