Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: A di-p-tolyldialkylsilane derivative, a photoluminescence polymer formed from the derivative, and methods for preparing the derivative and polymer are provided. The di-p-tolyldialkylsilane derivative is represented by the following formula (1): ##STR1## where R.sub.1 and R.sub.2 are independently selected from the group consisting of phenyl and --(CH.dbd.CH).sub.k R.sub.3 (k is an integer between and inclusive of 0 and 2, and R.sub.3 is hydrogen or alkyl), and X.sup.2 is selected from the group consisting of hydrogen, halogen atom and cyano group. The di-p-tolylalkylsilane derivative of the formula (1) is very useful as a monomer of a functional polymer. The photoluminescence polymer formed from the di-p-tolylalkylsilane derivative of the chemical formula (1) contains a repeating unit having a silicon between the conjugated double bonds, thereby suppressing electron movement of the conjugated double bond. As a result, a range of colors between blue and green, particularly, blue, can be obtained.

Abstract: Polyphenylene is prepared by exposing a poly(1,2-disubstituted-cyclohexa-3,5-diene) precursor to ultraviolet light in the presence of an acid catalyst. The acid catalyst is activated by the ultraviolet radiation and forms polyphenylene by aromatizing the cyclohexene rings of the poly(1,2-disubstituted-cyclohexa-3,5-diene).