Abstract: An image sensor includes a photoelectric converter configured to convert received light into charges in response to the received light and provide the charges to a first node, a transfer transistor configured to provide a voltage of the first node to a floating diffusion node, a reset transistor configured to reset a voltage of the floating diffusion node to a driving voltage based on a reset signal, a source follower transistor configured to provide a unit pixel output based on the voltage of the floating diffusion node, a select transistor connected to the source follower transistor and gated with a selection signal to output the unit pixel output to the outside, and a ferroelectric capacitor connected to the floating diffusion node, wherein the ferroelectric capacitor is configured to adjust a conversion gain of the floating diffusion node based on a conversion gain mode of the ferroelectric capacitor, the conversion gain mode being a first conversion gain mode, a second conversion gain mode, or a third co

Abstract: Disclosed is an input impedance boosting apparatus. More particularly, an input impedance boosting apparatus including an analog-to-digital converter; an input capacitor connected to an input terminal of the analog-to-digital converter and a ground line and including a first shielding metal formed thereunder; a feedback capacitor connected onto a positive feedback loop of the analog-to-digital converter and including a second shielding metal formed thereunder; and an impedance booster connected to both ends of the feedback capacitor and configured to boost an input impedance based on a first parasitic component formed between the input capacitor and the first shielding metal and a second parasitic component formed between the feedback capacitor and the second shielding metal is provided.

Abstract: Disclosed are a continuous-time delta-sigma analog-to-digital converter and an operation method thereof. More particularly, a continuous-time delta-sigma analog-to-digital converter, including: a linear integrator configured to generate a first output signal corresponding to a preset input voltage based on an operation of a linear Gm circuit that receives the preset input voltage; and a quantizer configured to generate a second output signal corresponding to the first output signal based on an operation of a body-driven VCO that receives the first output signal and to generate a digital output code corresponding to the second output signal based on an operation of a Frequency to Digital Converter (FDC) that receives the second output signal is disclosed.

Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.

Abstract: A semiconductor device includes a lower stack structure that includes a lower word line, an upper stack structure that is on the lower stack structure and includes an upper word line, a decoder that is adjacent to the lower stack structure and the upper stack structure, a signal interconnection that is connected to the decoder, a lower selector that is connected to the signal interconnection and further connected to the lower word line, and an upper selector that is connected to the signal interconnection, isolated from direct contact with the lower selector, and further connected to the upper word line.

Abstract: Discussed is an organic light emitting diode display device, including a display panel including an array substrate configured to display an image, a face sealing metal layer under the array substrate, and a protecting substrate under the face sealing metal layer, wherein the array substrate generates heat, and the generated heat is transferred from the array substrate to the protecting substrate via the face sealing metal layer to be radiated by the protecting substrate; and a printed circuit board under the protecting substrate, wherein an end portion of the array substrate, an end portion of the face sealing metal layer and an end portion of the protecting substrate form a stepped structure.

Abstract: According to one general aspect, an apparatus may include a host interface circuit configured to receive offloading instructions from a host processing device, wherein the offloading instructions instruct the apparatus to compute an error correction code associated with a plurality of data elements. The apparatus may include a memory interface circuit configured to receive the plurality of data elements. The apparatus may include a plurality of memory buffer circuits configured to temporarily store the plurality of data elements. The apparatus may include a plurality of error code computation circuits configured to, at least in part, compute the error correction code without additional processing by the host processing device.

Abstract: Provided is a thermoelectric cooling device comprising: a thermoelectric module; a heat sink having a body, which has on one side a contact surface coming into contact with a heating side of the thermoelectric module, and a plurality of heat dissipation fins, and emitting the heat transferred from the heating side of the thermoelectric module; a heat pipe coupled to a mounting groove which is formed on the contact surface of the heat sink, and for transferring heat by means of a working fluid stored therein; and a cooling fan for forming the airflow to the heat sink, wherein the heat pipe comprises a plurality of corner-extension heat pipes extending to a corner area of the heat sink from the central part of the heat sink on which the thermoelectric module is installed, and the shape of the mounting groove corresponds to the shape of the corner-extension heat pipes.

Abstract: A hoist communication device in a rail car of an automated material handling system in which a master communication unit and a slave communication unit perform power line communication through one power supply line provided on a belt and a rail car controller connected to the master communication unit is individually communicated with a plurality of gripper devices connected to the slave communication unit using different carrier frequencies.

Abstract: The present invention relates to an electrode cutting apparatus including a separated foreign matter removal unit capable of immediately removing separated foreign matter generated at the time of electrode cutting through a blow unit and a suction unit configured to be repeatedly operated and stopped according to an electrode cutting operation in order to remove separated foreign matter generated when the electrode cutting apparatus performs electrode cutting.

Abstract: A semiconductor device includes a first semiconductor structure including circuit devices and first bonding pads; and a second semiconductor structure connected to the first semiconductor structure, the second semiconductor structure including a base layer; a first memory cell structure including first gate electrodes and first channels penetrating through the first gate electrodes; a second memory cell structure including second gate electrodes and second channels penetrating through the second gate electrodes; bit lines between the first and the second memory cell structures, and electrically connected to the first and second channels in common; first and second conductive layers on the second surface of the base layer; a pad insulating layer having an opening exposing a portion of the second conductive layer; and second bonding pads disposed to correspond to the first bonding pads in a lower portion of the second memory cell structure.

Abstract: Disclosed are an ultrasound imaging system for analysis of a body composition and an operation method of an ultrasound imaging system which is designed for analysis of a body composition. An ultrasound imaging system may include: a scan device into which an object is insertable; an ultrasonic probe connected to a part of the scan device; a controller configured to control the ultrasonic probe to emit a transmission ultrasonic signal to the object at multiple positions at the scan device, and receive a reflection ultrasonic signal reflected from the object; and an image processor configured to generate multiple 2D ultrasound images based on reflection ultrasonic signals received at the multiple positions at the scan device, respectively, and generate a 3D ultrasound image based on the multiple 2D ultrasound images.

Abstract: A semiconductor device includes a stack structure on a substrate, the stack structure including alternating gate electrodes and insulating layers stacked along a first direction, a vertical opening through the stack structure along the first direction, the vertical opening including a channel structure having a semiconductor layer on an inner sidewall of the vertical opening, and a variable resistive material on the semiconductor layer, a vacancy concentration in the variable resistive material varies along its width to have a higher concentration closer to a center of the channel structure than to the semiconductor layer, and an impurity region on the substrate, the semiconductor layer contacting the impurity region at a bottom of the channel structure.

Abstract: Disclosed is a vehicle seat adjustment device including a seat-cushion-tilting frame disposed on a moving rail, the moving rail being coupled to a fixed rail so as to be movable forwards and backwards, and connected to a seatback frame, a tilting device hingedly coupled to a base bracket on the moving rail and to a rear end of the seat-cushion-tilting frame to perform forward tilting of the seat-cushion-tilting frame, a locking device connected to the tilting device to lock and unlock the tilting device, and a probe rotatably disposed between the seatback frame and the tilting device, the probe including a stopper capable of being inserted into a locking groove formed in the seatback frame. Rotation of the probe is restricted when the stopper is inserted into the locking groove.

Abstract: An atelocollagen according to an embodiment is characterized in that, when analyzed by high-performance liquid chromatography (HPLC), a peak area (S?) for a ? chain is larger than a second peak area for an ? chain (S?2) so that, when a physiologically active material is loaded therein, the atelocollagen may decrease rapid initial release of the physiologically active material or may control reduction in effects of the physiologically active material due to too slow initial release. Further, the atelocollagen of the present invention may exhibit excellent cancer metastasis inhibitory effects.

Abstract: A semiconductor device include a nonvolatile memory device, including a first well region formed in a substrate, a tunneling gate insulator formed on the first well region, a floating gate formed on the tunneling gate insulator, a control gate insulator formed on the substrate, a control gate formed on the control gate insulator, and a first source region and a first drain region formed on opposite sides of the control gate, respectively, and a first logic device, including a first logic well region formed in the substrate, a first logic gate insulator formed on the first logic well region, a first logic gate formed on the first logic gate insulator, wherein the first logic gate comprises substantially a same material as a material of the control gate of the nonvolatile memory device.

Abstract: A display control apparatus includes: an inputter configured to receive internal display information and external display information about a vehicle; a memory storing a control program for an internal display of the vehicle and an external display of the vehicle; and a processor configured to perform control on a brightness of the internal display and a brightness of the external display, in connection with a portable terminal, by executing the control program.

Abstract: Provided is a semiconductor memory device. The semiconductor memory device comprises a first semiconductor pattern including a first impurity region, a second impurity region, and a channel region, the first impurity region spaced apart from a substrate in a first direction and having a first conductivity type, the second impurity region having a second conductivity type different from the first conductivity type, and the channel region between the first impurity region and the second impurity region, a first conductive connection line connected to the first impurity region and extending in a second direction different from the first direction and a first gate structure extending in the first direction and including a first gate electrode and a first gate insulating film, wherein the first gate electrode penetrates the channel region and the first gate insulating film is between the first gate electrode and the semiconductor pattern.

Abstract: The present invention provides a related substance of (3S)-3-(4-(3-(1,4-dioxaspiro[4,5]dec-7-en-8-yl)benzyloxy)phenyl)hex-4-inoic acid, and a method for evaluating the quality of (3S)-3-(4-(3-(1,4-dioxaspiro[4,5]dec-7-en yl)benzyloxy)phenyl)hex-4-inoic acid using the same. According to the present invention, it is possible to evaluate the quality, stability and the like of a pharmaceutical composition comprising (3S)-3-(4-(3-(1,4-dioxaspiro[4,5]dec-7-en-8-yl)benzyloxy)phenyl)hex-4-inoic acid using a compound of Chemical Formula 2 or a salt thereof as a reference standard.

Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.