Patents by Inventor Hwan-Soo Lee

Hwan-Soo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190195935
    Abstract: An apparatus for checking an inductor includes a detector outputting a detection signal including information corresponding to a parallel resistance component of a checking target inductor; and a determiner receiving the detection signal and determining whether the checking target inductor is satisfactory based on a magnitude of the parallel resistance component.
    Type: Application
    Filed: June 27, 2018
    Publication date: June 27, 2019
    Inventors: Gun Woo KOO, Hwan Soo LEE, Jong Woo HAN
  • Publication number: 20190122795
    Abstract: A coil component includes a body including a coil including lead portions at both ends thereof and a magnetic material sealing the coil and external electrodes disposed on outer surfaces of the body and connected to the lead portions, respectively. An outer surface of the coil including at least one of an upper surface, a lower surface, and a side surface of the coil includes a surface area increasing portion.
    Type: Application
    Filed: June 25, 2018
    Publication date: April 25, 2019
    Inventors: Hwan Soo LEE, Sung Min SONG, Yoon Hee CHO
  • Publication number: 20190096552
    Abstract: A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.
    Type: Application
    Filed: July 10, 2018
    Publication date: March 28, 2019
    Inventors: Hwan Soo Lee, Yoon Hee Cho, Sung Min Song
  • Patent number: 10226886
    Abstract: An injection molding apparatus is usable in an injection machine to form an injection product. The slim injection molding apparatus includes a hot runner plate attachable to one side clamping plate of the injection machine and provided with a hot runner system; an upper core disposed in the hot runner plate; a lower core attachable to an opposite side clamping plate of the injection machine to face the upper core, the lower core configured to couple with the upper core to define a cavity corresponding to the injection product when the lower core is coupled to the upper core; and an ejecting core disposed in the lower core, the ejecting core configured to push the injection product upward when the upper core is separated from the lower core.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: March 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hak-do Kim, Min-sang Park, Hwan-soo Lee
  • Publication number: 20190057801
    Abstract: A coil component includes a body having a volume of 2.4 mm3 or less and including at least one coil member embedded therein, and first and second external electrodes partially or entirely formed on first and second surfaces of the body opposing each other, respectively, wherein the product of inductance Ls (?H) and S/l (mm) is 0.45 (?H·mm) or more to 0.75 (?H·mm) or less in which S (mm2) is an area of regions of the first and second external electrodes disposed on the first and second surfaces of the body, and 1 (mm) is a minimum spaced distance between the first and second external electrodes formed on the first and second surfaces of the body.
    Type: Application
    Filed: January 9, 2018
    Publication date: February 21, 2019
    Inventors: Hwan Soo LEE, Yoon Hee CHO, Sung Min SONG
  • Publication number: 20190019615
    Abstract: A coil component includes: a coil part including a coil conductor; and a body formed adjacently to the coil part and including first and second magnetic powder particles having different average particle sizes, wherein an average particle size of the first magnetic powder particles is smaller than an interval between adjacent patterns of the coil conductor, and an average particle size of the second magnetic powder particles is greater than the interval between the adjacent patterns of the coil conductor.
    Type: Application
    Filed: November 29, 2017
    Publication date: January 17, 2019
    Inventors: Hwan Soo LEE, Yoon Hee CHO, Sung Min SONG
  • Publication number: 20180268990
    Abstract: A coil component includes a support member, an internal coil supported by the support member, and external electrodes connected to the internal coil. The external electrodes may each include a first layer coming into contact with the internal coil and a second layer disposed on a surface of the first layer. The first layer may serve as a buffer layer for improving a contact property between the internal coil and the external electrode. The second layer may be disposed to come into at least partial contact with a first end portion of the support member and a second end portion of the support member.
    Type: Application
    Filed: November 28, 2017
    Publication date: September 20, 2018
    Inventors: Hwan Soo LEE, Han Wool RYU, Hyo Chan OH, Jin Ho KU, Byoung Hwa LEE
  • Patent number: 9852836
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Soo Park, Seong Min Chin, Hwan Soo Lee, Hye Yeon Cha
  • Patent number: 9741490
    Abstract: Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: August 22, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Young Do Kweon, Young Seuck Yoo, Hwan Soo Lee, Woon Chul Choi
  • Publication number: 20170200549
    Abstract: Disclosed herein are a metal-polymer complex film for an inductor and a method for manufacturing an inductor, the inductor being manufactured by using the metal-polymer complex film for an inductor, including: a metal powder; and an amorphous epoxy resin, wherein the metal-polymer complex film is made in a film type by using a mixture where a weight ratio of the metal powder is 75˜98 wt %, so that a plurality of inductors can be simultaneously manufactured to thereby improve production efficiency and characteristic values of the inductor can be also improved.
    Type: Application
    Filed: March 27, 2017
    Publication date: July 13, 2017
    Inventors: Moon Soo PARK, Ic Seob KIM, Hwan Soo LEE, Dong Hyeok CHOI, Hye Yeon CHA
  • Patent number: 9660013
    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwan Soo Lee, Hye Yeon Cha, Jung Min Park, Kang Heon Hur, Moon Soo Park
  • Patent number: 9654079
    Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: May 16, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Jin Woo Hahn, Joon Hwan Kwag, Kyoung No Lee, Myeong Gi Kim, Hwan Soo Lee
  • Publication number: 20160329146
    Abstract: There is provided a power inductor including: a lower substrate formed of a magnetic material; an inductor main body formed on an upper surface of the lower substrate; at least one coil portion including a conductive via and formed inside the inductor main body; and external electrodes formed at both ends of the inductor main body and electrically connected to the at least one coil portion.
    Type: Application
    Filed: July 20, 2016
    Publication date: November 10, 2016
    Inventors: Hwan-Soo LEE, Kang Heon HUR, Jung Min PARK, Hye Yeon CHA
  • Patent number: 9472608
    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: October 18, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Hwan Soo Lee, Hye Yeon Cha, Jung Min Park, Kang Heon Hur, Moon Soo Park
  • Publication number: 20160214297
    Abstract: An injection molding apparatus is usable in an injection machine to form an injection product. The slim injection molding apparatus includes a hot runner plate attachable to one side clamping plate of the injection machine and provided with a hot runner system; an upper core disposed in the hot runner plate; a lower core attachable to an opposite side clamping plate of the injection machine to face the upper core, the lower core configured to couple with the upper core to define a cavity corresponding to the injection product when the lower core is coupled to the upper core; and an ejecting core disposed in the lower core, the ejecting core configured to push the injection product upward when the upper core is separated from the lower core.
    Type: Application
    Filed: October 21, 2015
    Publication date: July 28, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hak-do KIM, Min-sang PARK, Hwan-soo LEE
  • Patent number: 9331009
    Abstract: A chip electronic component may be capable of improving connectivity between internal coils formed on upper and lower surfaces of an insulating substrate and preventing loss of inductance due to the areas of via pads by decreasing sizes of the outermost via electrodes and decreasing sizes of the via pad.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 3, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Yong Sam Lee, Hwan Soo Lee
  • Publication number: 20160118178
    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 28, 2016
    Inventors: Hwan Soo LEE, Hye Yeon CHA, Jung Min PARK, Kang Heon HUR, Moon Soo PARK
  • Patent number: 9269486
    Abstract: There is provided a power inductor, including a magnetic body including a substrate having coils formed thereon, a first metal-polymer complex layer formed on upper and lower surfaces of the substrate, and a second metal-polymer complex layer formed on upper and lower surfaces of the first metal-polymer complex layer and including a higher content of a polymer than that included in the first metal-polymer layer.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 23, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Moon Soo Park, Hwan Soo Lee, Hye Yeon Cha
  • Publication number: 20150325510
    Abstract: A chip electronic component may be capable of improving connectivity between internal coils formed on upper and lower surfaces of an insulating substrate and preventing loss of inductance due to the areas of via pads by decreasing sizes of the outermost via electrodes and decreasing sizes of the via pad.
    Type: Application
    Filed: August 18, 2014
    Publication date: November 12, 2015
    Inventors: Woon Chul CHOI, Yong Sam LEE, Hwan Soo LEE
  • Patent number: 9183979
    Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: November 10, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Kang Heon Hur, Sung Jin Park, Dong Jin Jeong, Jung Min Park, Hyeog Soo Shin, Sung Yong An, Hwan Soo Lee, Young Do Kweon, Jin Woo Hahn