Patents by Inventor Hwan Su Yoo

Hwan Su Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board
    Patent number: 12284758
    Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: April 22, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyun Bae, Hwan Su Yoo, Suk Chang Hong
  • PRINTED CIRCUIT BOARD
    Publication number: 20240074049
    Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.
    Type: Application
    Filed: February 24, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyun Bae, Hwan Su Yoo, Suk Chang Hong