Patents by Inventor Hwan-sun HONG

Hwan-sun HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Broadcast signal receiving apparatus and multi-layer printed circuit board
    Patent number: 9813093
    Abstract: A broadcast signal receiving apparatus, including a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable, wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: November 7, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Jun Kim, Sung-soo Lee, Hwan-sun Hong, Ja-hun Lee, Cheol-hee Lee
  • BROADCAST SIGNAL RECEIVING APPARATUS AND MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20160365882
    Abstract: A broadcast signal receiving apparatus, including a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable, wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board.
    Type: Application
    Filed: June 10, 2016
    Publication date: December 15, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Jun KIM, Sung-soo LEE, Hwan-sun HONG, Ja-hun LEE, Cheol-hee LEE