Patents by Inventor Hwan-Wen LEE

Hwan-Wen LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240013957
    Abstract: A high-power resistor and a fabrication method thereof are provided. The method includes: providing a resistance substrate including resistance alloy material and a copper metal layer; forming a cuprous oxide layer on the resistance substrate by using the copper metal layer; sticking the resistance substrate to a ceramic substrate, in which the cuprous oxide layer is located between the resistance substrate and the ceramic substrate; performing a sintering process on the resistance substrate and the ceramic substrate to form a composite substrate; forming a plurality of terminal electrodes on the composite substrate to form the high-power resistor. Therefore, the high-power resistor includes the composite substrate and the terminal electrodes. The composite substrate includes a bonding layer disposed between the ceramic substrate and the resistance substrate to bond the resistance alloy material on the ceramic substrate, in which the bonding layer includes sintered cuprous oxide.
    Type: Application
    Filed: September 7, 2022
    Publication date: January 11, 2024
    Inventors: Shen-Li HSIAO, Hwan-Wen LEE, Fu-Sheng HUANG
  • Publication number: 20230280379
    Abstract: Current sensing resistors and a method of manufacturing the same are disclosed in the present invention. A composite material is firstly provided in the method. Then, a first portion of an alloy substrate of the composite material is removed along a first direction to form a plurality of first trenches. Next, a second portion of the alloy substrate of the composite material is removed along a second direction to form a plurality of second trenches, and a third portion of the alloy substrate of the composite material is further removed along the first direction to form the current sensing resistors. The current sensing resistors with small dimensions and an extremely low temperature coefficient of resistance can be produced rapidly by the method of the present invention.
    Type: Application
    Filed: July 11, 2022
    Publication date: September 7, 2023
    Inventors: Shen-Li HSIAO, Hwan-Wen LEE
  • Patent number: 11569053
    Abstract: A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a cavity located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: January 31, 2023
    Assignee: YAGEO CORPORATION
    Inventors: Shen-Li Hsiao, Hwan-Wen Lee
  • Publication number: 20220223363
    Abstract: A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a concave located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.
    Type: Application
    Filed: May 4, 2021
    Publication date: July 14, 2022
    Inventors: Shen-Li HSIAO, Hwan-Wen LEE
  • Patent number: 10839991
    Abstract: In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: November 17, 2020
    Assignee: YAGEO CORPORATION
    Inventors: Shen-Li Hsiao, Kuang-Cheng Lin, Hwan-Wen Lee, Chih-Lung Chen
  • Patent number: 10818418
    Abstract: A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 27, 2020
    Assignee: YAGEO CORPORATION
    Inventors: Shen-Li Hsiao, Kuang-Cheng Lin, Hwan-Wen Lee, Chih-Lung Chen
  • Publication number: 20190295748
    Abstract: A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.
    Type: Application
    Filed: April 26, 2018
    Publication date: September 26, 2019
    Inventors: Shen-Li HSIAO, Kuang-Cheng LIN, Hwan-Wen LEE, Chih-Lung CHEN
  • Publication number: 20190287701
    Abstract: In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.
    Type: Application
    Filed: April 26, 2018
    Publication date: September 19, 2019
    Inventors: Shen-Li HSIAO, Kuang-Cheng LIN, Hwan-Wen LEE, Chih-Lung CHEN
  • Publication number: 20170084366
    Abstract: A resistor includes a body and two connecting members. The body is made from an ohmic material and has two opposite side faces. Each of the connecting members has a side surface that has a connecting region welded to a respective one of the side faces of the body.
    Type: Application
    Filed: February 29, 2016
    Publication date: March 23, 2017
    Applicant: YAGEO CORPORATION
    Inventors: Dong-Mou TSAI, Sheng-Li HSIAO, Shih-Hsin CHANG, Chih-Lung CHEN, Hwan-Wen LEE