Patents by Inventor Hwan Yong Jung

Hwan Yong Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER
    Publication number: 20100147563
    Abstract: Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.
    Type: Application
    Filed: June 2, 2009
    Publication date: June 17, 2010
    Applicant: SAMSUNG ELECTRO MECHANICS CO., LTD.
    Inventors: Young Po Park, Going Sik Kim, Hwan Yong Jung, Ha II Kim, Dong Gi An, Myeong Hui Jung