Patents by Inventor Hwang-Bok Ryu

Hwang-Bok Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus
    Patent number: 8156636
    Abstract: An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: April 17, 2012
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Goon Woo Kim, Whasu Sin, Jae Yong Park, Hwang-Bok Ryu
  • Method of forming at least one bonding structure
    Patent number: 8053351
    Abstract: A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: November 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwang-Bok Ryu, Ky-Hyun Jung, Jae-Yong Park, Ho-Geon Song
  • METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE
    Publication number: 20110136334
    Abstract: A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.
    Type: Application
    Filed: October 13, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwang-Bok Ryu, Ky-Hyun Jung, Jae-Yong Park, Ho-Geon Song
  • APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
    Publication number: 20100071854
    Abstract: An apparatus and a method of manufacturing a semiconductor package are provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside one equipment. Thus, time required for a semiconductor packaging process decreases and yield is increased.
    Type: Application
    Filed: September 17, 2009
    Publication date: March 25, 2010
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Goon Woo KIM, Whasu Sin, Jae Yong Park, Hwang-Bok Ryu