Abstract: Disclosed is a biosensor including a light-emitting element, a photo-detective element, a light transmitting layer under the light-emitting element and the photo-detective element, and an optical structure inside the light transmitting layer and configured to control a propagation direction of light, a biosensor array and a device.

Abstract: Provided is a solar cell and a manufacturing method thereof. The cell includes a back-contact electrode on a substrate, a light absorbing layer on the back-contact electrode, an anti-defect layer on the light absorbing layer, a buffer layer on the anti-defect layer, and an upper electrode on a buffer layer. The anti-defect layer may contain an alkaline earth metal.

Abstract: A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.

Abstract: A method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.

Abstract: A flat panel displaying apparatus is disclosed. The flat panel displaying apparatus includes a liquid crystal display module displaying a picture, a chassis surrounding edges of the liquid crystal display module, defining an external appearance of the flat panel displaying apparatus, a printed circuit board provided with a connector connected to an external system by a connection cable, being grounded to the chassis, a liquid crystal display controller provided in the printed circuit board, activating the liquid crystal display module, and a ground portion formed around the liquid crystal display controller. With this configuration, emission of electromagnetic waves of the printed circuit board is minimized and reliability of the product is enhanced.

Abstract: A flat panel displaying apparatus is disclosed. The flat panel displaying apparatus includes a liquid crystal display module displaying a picture, a chassis surrounding edges of the liquid crystal display module, defining an external appearance of the flat panel displaying apparatus, a printed circuit board provided with a connector connected to an external system by a connection cable, being grounded to the chassis, a liquid crystal display controller provided in the printed circuit board, activating the liquid crystal display module, and a ground portion formed around the liquid crystal display controller. With this configuration, emission of electromagnetic waves of the printed circuit board is minimized and reliability of the product is enhanced.

Abstract: A method and apparatus for generating a modulo address for accessing a circular buffer. The method and apparatus accept as inputs a length L of the circular buffer, a current address A of the circular buffer, and an offset M between the current address and the next address to be generated. The offset M may be positive or negative. During operation of the present invention, the current address A first is broken down into a base address B and an offset from the base address a. Then, in accordance with the length L and the offset M, the invention determines an absolute offset and a wrapped offset. One of these offsets is added to the base address B to generate a next address for the circular buffer. The determination of which offset to add to the base address B is made by performing one of two comparisons.

Abstract: A method and apparatus for generating a modulo address for accessing a circular buffer. The method and apparatus accept as inputs a length L of the circular buffer, a current address A of the circular buffer, and an offset M between the current address and the next address to be generated. The offset M may be positive or negative. During operation of the present invention, the current address A first is broken down into a base address B and an offset from the base address a. Then, in accordance with the length L and the offset M, the invention determines an absolute offset and a wrapped offset. One of these offsets is added to the base address B to generate a next address for the circular buffer. The determination of which offset to add to the base address B is made by performing one of two comparisons.

Abstract: An apparatus and method using a neural network processor for target detection is described. An array of injection mode infrared detectors, whose output signals convey intensity change information of detected objects in a pulse train output form is combined with a frequency division multiplexer to apply the information to a minimum number of multiplexed channels, and transmit the detector output signals to the processor in a continuous mode. A multi-layer neural network processor is used to localize global information and concentrate on areas of interest through matrix transformation applied by the various neural layers.