Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.

Abstract: A semiconductor device and a method of manufacturing the same. The semiconductor device may include a lower electrode having a hollow cylindrical shape of which an upper portion is open, the lower electrode being disposed on a substrate, an insulating structure wrapping the lower electrode and including a nitride, a variable resistance pattern electrically connected to the lower electrode, and an upper electrode electrically connected to the variable resistance pattern.