Abstract: An embodiment cooling system for in-wheel motor vehicles includes first coolant flow paths provided in in-wheel motors mounted in wheels of a vehicle, second coolant flow paths provided in inverters configured to drive and control the in-wheel motors, a radiator configured to pass therethrough a coolant having cooled the inverters and the in-wheel motors to dissipate heat from the coolant, a coolant circulation line connecting the first and second coolant flow paths and the radiator, wherein a portion of the coolant circulation line located at upstream sides of the inverters based on a coolant circulation path is branched off into secondary coolant circulation lines respectively connected to the inverters, and water pumps disposed on the coolant circulation line and configured to pump the coolant, wherein the coolant pumped by the water pumps is distributed and passes through the inverters in parallel by way of the secondary coolant circulation lines.

Abstract: A semiconductor device and a method of manufacturing the same. The semiconductor device may include a lower electrode having a hollow cylindrical shape of which an upper portion is open, the lower electrode being disposed on a substrate, an insulating structure wrapping the lower electrode and including a nitride, a variable resistance pattern electrically connected to the lower electrode, and an upper electrode electrically connected to the variable resistance pattern.