Abstract: A refrigerator includes a cool air passage for guiding the flow of cool air to a freezing compartment and a cool air passage for guiding the flow of cool air to an ice-making compartment that partially share the cool air. Through the sharing of cool air, the amount of cool air supplied to the freezing compartment is increased and sufficient cool air is supplied to the refrigerating compartment. Accordingly, sufficient cool air is supplied to the refrigerating compartment, the freezing compartment, and the ice-making compartment even with a single evaporator.

Abstract: A composition for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes a Siphoviridae bacteriophage (Bac-FRP-5) having an ability to lyse the enterotoxigenic Bacteroides fragilis cells and a pharmaceutically acceptable carrier. A method for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes administering to a subject a Siphoviridae bacteriophage and lysing the enterotoxigenic Bacteroides fragilis cells by the Siphoviridae bacteriophage.

Abstract: A refrigerator includes a refrigerating compartment, a freezing compartment, and an ice-making compartment. The refrigerating compartment is configured to receive cool air from a refrigerating compartment side grille fan assembly, and the ice-making compartment is configured to be located any one refrigerating compartment door and to receive cool air from a freezing compartment side grille fan assembly with the freezing compartment. The refrigerating compartment side grille fan assembly is configured to supply a greater amount of cool air to the side where the ice-making compartment and the refrigerating compartment side grille fan assembly are located, and to perform cool air supply proportional to temperature influence provided from the ice-making compartment and the refrigerating compartment side grille fan assembly.

Abstract: A composition for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes a Siphoviridae bacteriophage (Bac-FRP-4) having an ability to lyse the enterotoxigenic Bacteroides fragilis cells and a pharmaceutically acceptable carrier. A method for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes administering to a subject a Siphoviridae bacteriophage and lysing the enterotoxigenic Bacteroides fragilis cells by the Siphoviridae bacteriophage.

Abstract: A refrigerator is configured to supply cool air to a refrigerating compartment, a freezing compartment, and an ice-making compartment by a single evaporator. A cool air passage for the ice-making compartment for supplying cool air to the ice-making compartment is configured to supply the cool air to an upper space in a cool air passage for the freezing compartment, which supplies cool air to the refrigerating compartment and the freezing compartment, through an upper supply passage. Accordingly, since additional cool air is supplied to the cool air passage for the freezing compartment by using the upper supply passage, sufficient cool air is supplied to the refrigerating compartment and the freezing compartment by the single evaporator.

Abstract: A composition for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes a Siphoviridae bacteriophage (Bac-FRP-3) having an ability to lyse the enterotoxigenic Bacteroides fragilis cells and a pharmaceutically acceptable carrier. A method for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes administering to a subject a Siphoviridae bacteriophage and lysing the enterotoxigenic Bacteroides fragilis cells by the Siphoviridae bacteriophage.

Abstract: A display panel includes a base substrate, a display structure layer located on the base substrate of a display region and including multiple display region metal layers, a touch structure layer, multiple contact pads, and a first inorganic insulating layer. The touch structure layer is located on a side of the display structure layer away from the base substrate. The multiple contact pads are located in the first bezel region, and at least one contact pad includes at least one contact pad metal layer. The first inorganic insulating layer exposes at least part of surfaces of contact pad metal layers of the multiple contact pads away from the base substrate. The contact pad metal layer of the at least one contact pad exposed by the first inorganic insulating layer and one of the multiple display region metal layers of the display structure layer are of a same layer structure.

Abstract: A semiconductor package includes: a first redistribution line structure; a first semiconductor chip on one surface of the first redistribution line structure; a first conductive bump between, and connecting, the first redistribution line structure and the first semiconductor chip; a first encapsulant encapsulating at least a portion of the first semiconductor chip; a second semiconductor chip on another, opposite surface of the first redistribution line and including a through via; a second conductive bump between, and connecting, the first redistribution line structure and the second semiconductor chip; a second encapsulant encapsulating at least a portion of the second semiconductor chip; and a second redistribution line structure on the second encapsulant. The second encapsulant covers at least a portion of a surface of the second semiconductor chip facing the second redistribution line structure.

Abstract: An apparatus for fixing an instrument within the intestinal canal, is a fixing apparatus for surrounding, from outside the intestinal canal, and fixing an instrument that is installed within the intestinal canal for protecting an anastomotic site after a resection surgery of a tube-type organ, characterized in that the apparatus for fixing an instrument within the intestinal canal has a band-shaped body wherein the body is formed of a biodegradable (absorbent) material or a non-absorbent material, which does not react with foreign bodies in the human body, wherein the body has a low elongation rate in the length direction thereof, and wherein both edges of the body in the width direction thereof are processed so as to have a flexible form so that when the edges come in contact with an outer surface of the intestinal canal, injuries are not made to the outer surface of the intestinal canal.

Abstract: A display panel and a preparation method therefor, and a display apparatus. The display panel comprises: a display region and a bezel region surrounding the display region; a barrier structure, located in the bezel region and arranged on one side of the base substrate, surrounding the display region; a touch-control electrode lead, comprising a first metal lead and a metal connection bridge which are electrically connected; said first metal lead is arranged on the upper side of said barrier structure; the first metal lead extends from the display region to the bezel region and is located on the side of the barrier structure facing the display region; said metal connection bridge is located in the bezel region; the metal connection bridge is arranged between the base substrate and the surface of the barrier structure on the side away from the base substrate.

Abstract: A method for extracting a fingerprint of a video includes calculating 2D discrete cosine transform (DCT) coefficients from each of the plurality of frames of the video, extracting, from the 2D DCT coefficients, a coefficient having a basis satisfying at least one of up-down symmetry or left-right symmetry, and calculating a fingerprint of the video based on the extracted coefficient.

Abstract: A composition for treating an infection or disease caused by a pathogenic Escherichia coli includes a Myoviridae bacteriophage Esc-COP-23 having an ability to lyse the pathogenic Escherichia coli and a pharmaceutically acceptable carrier. A method for treating an infection or disease caused by a pathogenic Escherichia coli includes administering to a subject a Myoviridae bacteriophage and lysing the pathogenic Escherichia coli by the Myoviridae bacteriophage.

Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: The present disclosure relates to semiconductor packages and methods for manufacturing semiconductor packages. An example semiconductor package includes a top die, first and second bottom dies attached on a lower surface of the top die and being apart from each other by a preset distance, and at least one decoupling capacitor connected to the lower surface of the top die between the first bottom die and the second bottom die. The top die, the first bottom die, and the second bottom die are chiplets.

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.

Abstract: The present disclosure provides a touch substrate, a touch display panel and a display apparatus. A line width of at least a part of a bridging electrode in a spacing region between a sub-electrode of a corresponding first touch electrode and a corresponding second touch electrode in a first direction is greater than a line width of the corresponding second touch electrode, so that a routing length of an edge of the bridging electrode in the spacing region can be increased, or so that a certain gap exists between the sub-electrode and the residual metal at the edge of the bridging electrode, the sub-electrode is insulated from the residual metal, the short circuit between the first touch electrode where the sub-electrode is located and the second touch electrode due to the metal residue can be avoided, and the touch quality of the touch substrate can be ensured.

Abstract: A semiconductor package includes a first redistribution layer; a first semiconductor chip above the first redistribution layer; a second semiconductor chip above the first semiconductor chip; a second redistribution layer above the second semiconductor chip; a first connection structure on the second redistribution layer; a connection post on the first connection structure; and a connection interconnection layer on the connection post, wherein the connection interconnection layer comprises a connection insulating layer and a connection via extending through the connection insulating layer, and wherein the second redistribution layer and the first redistribution layer are electrically connected to each other through a wire.

Abstract: The present disclosure relates to a cleaner which includes: a dustbin having a slit formed on one side thereof; a compression lever housing disposed on an outside of the slit and mounted to the dustbin; a compression plate disposed on an inside of the dustbin and configured to ascend in a direction in which the slit extends; and a sealer disposed in the compression lever housing, coming in close contact with the slit, and extending along the slit. Therefore, the cleaner according to the present disclosure may prevent a problem that is likely to occur during an operation of the compression lever assembly because of trapped dust, and can be maintained in a cleaner state as the user may easily separate the cleaner by assemblies to sterilize the parts.