Patents by Inventor Hwang Sub Koo

Hwang Sub Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11037888
    Abstract: The present invention relates to a nitride-based electronic device and a method for manufacturing same, the nitride-based electronic device comprising a substrate, a metal electrode and a plurality of protection layers, wherein, among the protection layers, at least two protection layers covering one portion of the electrode so that one portion of the upper part of the electrode is exposed are configured so that the upper protection layer covers the end part of the lower protection layer so as to prevent the end part of the lower protection layer from being exposed.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: June 15, 2021
    Assignee: WAVICE INC.
    Inventors: Sang Min Lee, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Patent number: 10750612
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: August 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10624209
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: April 14, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10566710
    Abstract: Disclosed is a coaxial cable connector which can be manufactured in an ultra-thin type. The coaxial cable connector of the present invention comprises: a signal pin; a dielectric coupled to the signal pin; a first body coupled to a connector electrically connected to one side of the signal pin; and a second body extending from the first body and coupled to a cable electrically connected to the other side of the signal pin, wherein the second body includes a fixing portion for fixing the dielectric, and the dielectric includes a to-be-fixed portion corresponding to the fixing portion.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: February 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Jin Uk Lee, Sang Min Seo, Jang Mook Lee, Sun Tae Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10561015
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: February 11, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10477690
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: November 12, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190295962
    Abstract: The present invention relates to a nitride-based electronic device and a method for manufacturing same, the nitride-based electronic device comprising a substrate, a metal electrode and a plurality of protection layers, wherein, among the protection layers, at least two protection layers covering one portion of the electrode so that one portion of the upper part of the electrode is exposed are configured so that the upper protection layer covers the end part of the lower protection layer so as to prevent the end part of the lower protection layer from being exposed.
    Type: Application
    Filed: November 3, 2017
    Publication date: September 26, 2019
    Inventors: Sang Min Lee, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Publication number: 20190239343
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190239344
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10365687
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10362675
    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 23, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10356895
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 16, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10299375
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 21, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190140371
    Abstract: Disclosed is a coaxial cable connector which can be manufactured in an ultra-thin type. The coaxial cable connector of the present invention comprises: a signal pin; a dielectric coupled to the signal pin; a first body coupled to a connector electrically connected to one side of the signal pin; and a second body extending from the first body and coupled to a cable electrically connected to the other side of the signal pin, wherein the second body includes a fixing portion for fixing the dielectric, and the dielectric includes a to-be-fixed portion corresponding to the fixing portion.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 9, 2019
    Inventors: Jin Uk LEE, Sang Min SEO, Jang Mook LEE, Sun Tae KIM, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Patent number: 10276949
    Abstract: Provided are a connector and a blind mating connector including the same. The connector in accordance with the present invention includes a hollow body formed by bending a metal plate that is manufactured by press-processing a raw plate, a dielectric part built in the body, a signal pin passing through the dielectric part, a plurality of contact parts extending from both ends of the body, respectively, with a slit therebetween, a connection part defined in the body and at which both side ends of the metal plate are met and coupled, and an extension contact part bent and extending from one end of the contact part in a direction opposite to an extension direction of the contact part to face the contact part.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Publication number: 20190053379
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Application
    Filed: February 8, 2017
    Publication date: February 14, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190041907
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Application
    Filed: July 5, 2016
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190045630
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Application
    Filed: February 6, 2017
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20180269604
    Abstract: Provided are a connector and a blind mating connector including the same. The connector in accordance with the present invention includes a hollow body formed by bending a metal plate that is manufactured by press-processing a raw plate, a dielectric part built in the body, a signal pin passing through the dielectric part, a plurality of contact parts extending from both ends of the body, respectively, with a slit therebetween, a connection part defined in the body and at which both side ends of the metal plate are met and coupled, and an extension contact part bent and extending from one end of the contact part in a direction opposite to an extension direction of the contact part to face the contact part.
    Type: Application
    Filed: January 17, 2018
    Publication date: September 20, 2018
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: D848370
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: May 14, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung