Patents by Inventor Hwanggil SHIM

Hwanggil SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9355931
    Abstract: Package-on-package (POP) devices and methods of manufacturing the POP devices are provided. In the POP devices, a thermal interface material layer disposed between lower and upper semiconductor packages may contact about 70% or greater of an area of a top surface of a lower semiconductor chip. According to methods, the upper semiconductor package may be mounted on the lower semiconductor chip using a weight.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: May 31, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongkook Kim, Jangwoo Lee, Kyoungsei Choi, Sayoon Kang, Donghan Kim, Hwanggil Shim
  • Publication number: 20150206869
    Abstract: Package-on-package (POP) devices and methods of manufacturing the POP devices are provided. In the POP devices, a thermal interface material layer disposed between lower and upper semiconductor packages may contact about 70% or greater of an area of a top surface of a lower semiconductor chip. According to methods, the upper semiconductor package may be mounted on the lower semiconductor chip using a weight.
    Type: Application
    Filed: October 17, 2014
    Publication date: July 23, 2015
    Inventors: Jongkook KIM, Jangwoo LEE, Kyoungsei CHOI, Sayoon KANG, Donghan KIM, Hwanggil SHIM