Abstract: A lens module is provided. The lens module includes a first lens, a second lens, and a third lens sequentially disposed from an object side to an imaging side, a first spacing member disposed between the first lens and the second lens and having a first passage extending in a direction that intersects an optical axis, a second spacing member disposed between the second lens and the third lens and having a second passage extending in a direction that intersects the optical axis, and a lens barrel configured to accommodate the first lens, the second lens, the third lens, the first spacing member and the second spacing member, and configured to have a first connection passage disposed on an inner side surface and connected to the first passage and the second passage.

Abstract: An optical imaging system includes a first lens having negative refractive power, a second lens having negative refractive power, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. The first to seventh lenses are sequentially disposed from an object side toward an image side. The third lens, the fourth lens, the sixth lens, and the seventh lens are formed of plastic, and the first lens, the second lens, and the fifth lens are formed of glass.

Abstract: A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in the second area, and a thermal diffusion structure is on a top face of the interposer in the first area. The thermal diffusion structure is configured so that heat generated in the first die is discharged through the thermal diffusion structure.

Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.